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CAF (conductive anodic filament) failures are an electrochemical migration (ECM) process that causes short circuits in PCBs. iNEMI’s Characterization for CAF and ECM Failure Mitigation project will assess several areas of concern related to CAF failure: (1) scaling and integration of laser and mechanical drill features, (2) incoming quality measures of glass/resin systems, and (3) manufacturing process factors that may limit future targets and demands. The project plans to:
- Lower design reliability risk through characterization and study of focused incoming material and process factors driving CAF.
- Enable pitch scaling and higher density board technologies and identify high risk PCB technology features.
- Develop a better understanding of CAF through hardware failure analysis and build awareness of failure mechanisms.
- Enable predictive methodologies for laser and mechanical drill features.
- Reduce product qualification costs and associated timescales.
Registration
Join our information webinar September 7 or 8 to learn more about this project and how it can benefit your company. Two sessions are scheduled (with the same content) and are open to industry. Advance registration is required. For additional information, visit iNEMI's website.
Session 1
Wednesday, September 7, 2022
8:00-9:00 a.m. PDT (US)
11:00 a.m.-12:00 p.m. EDT (US)
5:00-6:00 p.m. CEST (Europe)
Session 2
Thursday, September 8
7:00-8:00 a.m. CST (China)
4:00-5:00 p.m. PDT (US) on September 7
7:00-8:00 p.m. EDT (US) on September 7
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