Reading time ( words)
IPC will be holding a PCB troubleshooting and defect analysis training course from Sep 13–Oct 6, 2022, every Tuesdays and Thursdays, from 6:30pm–8:30pm.
Taught by an IPC-certified industry expert with more than 40 years of experience in the field, this four-week online program is designed to provide the knowledge and skills necessary to identify PCB defects and determine corrective action.
The IPC Advanced Troubleshooting and Defect Analysis course is designed to provide participants with the knowledge and skills necessary to identify printed circuit board defects and determine corrective action.
Upon completion, participants will be able to:
- Identify and correct control processes that negatively affect circuit board quality
- Establish the root cause of potential defects to minimize and prevent loss of quality
- Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality
- Identify the root cause and corrective action for PCB defects such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away
- Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating..
- Identify the root cause and corrective action for solderability and assembly related issues such as outgassing, black pad, creep corrosion and blow holes
The training program utilizes interactive webinars, on-demand recordings, and job-specific exercises to facilitate mastery of the key concepts required for successful printed circuit board trouble shooting and defect analysis.
For more information and to register, visit https://www.ipc.org/event/pcb-troubleshooting-and-defect-analysis-0.
Nolan Johnson, I-Connect007
This week, our five must-reads include the IPC report on the EMS industry and a report on ICs for the automotive market. Add to that Lockheed’s highest powered DoD laser yet, IPC’s APEX keynote announcement, and—for you conference and expo junkies—a calendar of upcoming industry events. I can’t help but notice that much of our news is about, well, something new. In this case, my editor’s picks for the week capture new technology, new perspectives, new ways to communicate content, and new developments that we can expect to see in our future daily life. To borrow a phrase from the TV show “Firefly,” everything is “shiny” this week. I will be at PCB West, the IPC Advanced Packaging symposium, SMTA International, and electronica. If you see me, say hello, and share something cool about the part of the industry you’re in.
I-Connect007 Editorial Team
Michael Carano is a noted subject matter expert with respect to process control, electroplating and metallization technology, surface finishing, and reliability. So, it was only natural that we sat down to talk about mechanizing an existing facility given today’s fickle environment. Will any of the CHIPS funding trickle down to bare board fabrication? What process can be adjusted on the factory floor? The focus needs to be more than just on manufacturing and getting work out the door, he says, but also process control.
Andy Shaughnessy, Design007 Magazine
It’s officially fall now, and in Atlanta the temperature has plummeted to the mid-80s. We’ve all bumped our air conditioners up to 74 degrees. That means it’s trade show season, and I’ve been busy looking for my suitcase. This week, we have an assortment of news about associations, education, and advocacy, as well as another installment of our Printed Electronics Roundtable. And if you’re looking for a job, you are in luck; our jobConnect007 section is chock-full of open positions at all levels in this industry.