Atotech to Participate at KPCA 2022

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Atotech, MKS’ globally leading brand in surface-finishing solutions announced to take part at this year’s KPCA Show to be held at Songdo Convensia, Incheon, Korea, from September 21-23. Experts from MKS’ Atotech and MKS’ ESI brands will be available to discuss latest industry trends and challenges, as well as introduce the new combined product offering consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service. The company will be exhibiting at booth: #G201 with the following products on display: 

Flex PCB production using UV laser

• Innerlayer treatment & lamination: BondFilm® Series and CupraEtch®Series
• Cu thinning: HyperEtch®
• Via formation: CapstoneTM, 5535TM, RedStoneTM, LodeStoneTM, RedStoneXPTM
• Primary metallization: ViaKing® Series, Neoganth® Activation and Printoganth®
• E’less Cu combined with Uniplate® LB / Polygon platform
• Via Plate/Fill: Inpusle® Series combined with Uniplate® Cu, InPro® Series combined with V-Plate® platform; Cupracid® Series

HDI PCB production using CO2 laser

• Innerlayer treatment & lamination: BondFilm® and CupraEtch® combined with Horizon® platform
• Cu thinning: HyperEtch®
• Laser pretreatment: BondFilm®LDD combined with Horizon® platform
• Via formation: GeodeTM
• Laser post-treatment: BondFilm®LDD SR combined with Horizon® / Polygon platform
• Primary metallization: Securiganth®Desmear combined with UniPlate® P, Neoganth® Activator and Printoganth® E’less Cu combined with Uniplate® LB
• Via Plate/Fill: Inpusle® Series combined with Uniplate® Cu, InPro® Series combined with V-Plate® platform; Cupracid® Series

IC Packaging production using CO2 laser 

• Innerlayer treatment & lamination: NovaBond® Series
• Via formation: GeodeTM A
• Primary metallization: Securiganth®Desmear combined with UniPlate® P, Neoganth® Activator and Printoganth® E’less Cu combined with Uniplate® LB
• Image: AdHere® Series and Imagine DS
• Via Plate/Fill: Inpusle® Series combined with Uniplate® Cu, InPro® Series combined with V-Plate® platform
• Strip and Etch: ResistStrip ® Series, EcoFlash®, Hyperflash®, PallaStrip®

02/27/2023 | Pete Starkey, I-Connect007

The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.

12/13/2022 | Pete Starkey, I-Connect007

Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme. Guest speakers highlighted new technology in selective solder nozzles, flexible circuits, industry cooperation, and a greener future by recycling PCBs.

10/31/2022 | Nolan Johnson, I-Connect007

Stefan Stefanescu is head of business development for Atotech’s industrial digital transformation solutions. Here, he discusses how the Digital Factory Suite (DFS) fits into a PCB fabricator’s workflow. The new software connects to the onsite production equipment and continuously collects process and equipment data. But it’s more than that, Stefan says. It’s a way to help customers increase productivity and take steps toward developing a smart factory.