I-Connect007 Editor’s Choice: Five Must-Reads for the Week


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It feels like the first day of school. It’s September, and we’re all officially back at our desks, workstations, or kitchen tables. Even Les Vacances is over. Oui, c’est vrai! 

But instead of facing new teachers, we have to deal with diverse market forces, supply chain issues, and technology that never seems to stop evolving. Of course, that’s what makes this industry so interesting, isn’t it?

This week we highlight some news from industry organizations, an update on the CHIPS Act, and a few columns that focus on failures and what we can learn from them. As Dan Beaulieu points out, failure is an important part of succeeding in the long run, and our industry needs to stop being so “failure-phobic.” 

Hold on to your hats, folks. It’s going to be a busy fall! See you in a few weeks.

IPC APEX EXPO 2023 Offers New Courses, New Instructors, and IPC E-Textiles
Published September 9

Today, registration opened for IPC APEX EXPO 2023 in San Diego, slated for Jan. 21–26, 2023. Co-located with the IPC E-Textiles conference on Jan. 23, 2023, the theme for the show is “Advances in a New Era.” The event will feature conference tracks for PCB design, fabrication, and assembly, and we’ll see the return of the PCB design competition as well.

This marks the last IPC APEX EXPO in San Diego for a few years; the show will be held at the Anaheim Convention Center from 2024 through 2026.

Will Marsh: CHIPS Act Update
Published September 6

In one of the few bipartisan efforts to take place in Washington lately, the CHIPS Act was voted through Congress and signed into law by the president. Color me skeptical, but what happens after this whole Kumbaya vibe has faded and it’s time to get to work? Editor Nolan Johnson asks PCBAA President Will Marsh to explain what’s next for this endeavor, and Will fills us in on details of the Supporting American Printed Circuit Boards Act of 2022 as well.

It’s Only Common Sense: It’s Time to Fail
Published September 5

Columnist Dan Beaulieu had a great piece this week on the importance of failing, and being able to learn from our failures. Too often, this industry places a premium on succeeding right now, on the first attempt, and woe to those who suffer a snafu or two along the way. Dan takes a look at some of the failures suffered by people who are now household names, including Henry Ford, Jerry Seinfeld, and Michael Jordan. My favorite MJ story: He missed 9,000 shots in his career.

EIPC Technical Snapshot Webinar
Published September 7

In keeping with the back-to-school theme, EIPC is offering a Technical Snapshot Webinar on Sept. 14 at 15:00 CET. Moderated by EIPC President Alun Morgan, the webinar features four 15-minute presentations, followed by a Q&A session. It’s free to EIPC members and only 50 euros for non-members. Don’t be tardy.

X-Rayted Files: My Favorite BGA Assembly Ever, Part 3
Published September 7

In his latest column, Bill Cardoso discusses his “favorite BGA assembly ever.” As he points out, it’s not his fave because it worked wonderfully; on the contrary, it has so many defects that it’s a perfect illustration of the problems he encounters in BGA assembly every day. Do you have a similar “favorite” PCB project that failed so badly that it’s a textbook example of what not to do?

          

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Suggested Items

PCB Technologies Sees Substrates as a Foundation

10/27/2022 | Nolan Johnson, I-Connect007
In this interview, PCB Technologies CEO Oved Shapira discusses the company's move into advanced packaging and heterogenous integration. Shapira explains how substrates and advanced packaging fit into the PCB fab and assembly ecosystem, and makes the argument that an all-inclusive fabrication and assembly supplier can be of great value to customers in product development and small scale production.

IPC Advanced Packaging Symposium to Draw Industry, Government Representatives

08/22/2022 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with IPC’s Chris Mitchell, vice president of global government relations, and Matt Kelly, chief technologist, about the inaugural IPC Advanced Packaging Symposium, scheduled for October 11-12, 2022 in Washington, DC. In this conversation, Mitchell and Kelly detail the symposium's objectives, presenters, and the value to both fabricators and assemblers in attending.

ICT Autumn Seminar Review: Live in 2021!

12/07/2021 | Pete Starkey, I-Connect007
Faced with the choice between a real or virtual event, Bill Wilkie took a calculated risk. It has been many long months since members of the Institute of Circuit Technology had gathered together under one roof, but a fair-sized bunch of industry stalwarts braved the weather and the threat of COVID, descended on the Manor Hotel in Meriden, UK, on Nov. 30, and applauded Bill’s decision to go live. They were not disappointed; the program was superb, the atmosphere upbeat, and the networking opportunity priceless.



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