September 2022 Issue of PCB007 Magazine Available Now

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In this issue of PCB007 Magazine, we explore ideas for mechanization/automation of your existing facility. At first blush, this theme would suggest a major concentration on manufacturing floor details, or maybe a heavy dose of new capital equipment and line design topics. As you'll learn, it's much more than that.

In our kick-off expert interview, Alex Stepinski makes the strategic-level case for a specific set of duties to be performed by a chief technology officer. Also featured in this issue: Michael Carano, speaking on the IPC Thought Leaders program and his insights on the industry and why upgrading capabilities are essential, plus Dana Korf discussing developments in materials that influence manufacturing processes. This brings us back to updating our brownfield facilities.

The rest of the issue contains articles and columns examining the technical details of board fabrication: microvia reliability advances, automating wet processes; thoughts on the manufacturing industry, and more.

Preview or download your PDF copy today! Subscribe here for delivery in your e-mailbox.


Suggested Items

NIST Resources for CHIPS Act Participants

01/27/2023 | Nolan Johnson, I-Connect007
At the recent IPC Advanced Packaging Symposium, Dr. Frank W. Gayle, deputy director of the Advanced Manufacturing National Program Office, an interagency team with core staff hosted at the U.S. National Institute of Standards and Technology (NIST), gave a presentation on the work NIST has recently undertaken in support of both the semiconductor and R&D sectors, and the CHIPS and Science Act.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/27/2023 | Nolan Johnson, I-Connect007
This week, the IPC APEX EXPO event has cast a long shadow across the news feeds. No, that’s not the right metaphor. No, not a shadow; shadows are dark. It would be more accurate to say IPC APEX EXPO cast a beam of illumination upon the news feeds for the electronics manufacturing industry. To that end, the APEX EXPO news makes a prominent appearance in this week’s editor’s picks.

Integra: Redefining Die Prep in the U.S.

01/25/2023 | Matt Bergeron, Integra
Integra is one of the largest and most experienced semiconductor die prep, assembly, test, and qualification facilities in the United States, with locations in both Wichita, Kansas, and Silicon Valley. At the recent IPC Advanced Packaging Symposium, Integra was invited to present information about how we meet our customers’ specific needs.

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