New Senior Director of Business Development Joins Ventec U.S. Team


Reading time ( words)

Ventec International Group Co., Ltd. announces the appointment of Paul Cooke as Senior Director of Business Development. With a holistic focus across the entire US region, Paul will further develop Ventec’s customer base in all key industry segments, including the core automotive, military, and aerospace sectors. Driven by the growing demand for Ventec’s products, as Sr. Director Business Development, Paul will also expand our US team with experienced individuals who provide exceptional customer solutions.

Paul comes to Ventec with 30 years of combined sales and engineering experience as a leading field application engineer in the PCB and electronics industries. An expert in both client and internal team relations, he has a comprehensive history in developing customer-led solutions, as well as a strong focus on training and industry education. Paul is a leader with several PCB standards organizations, including IPC, HDPUG and SMTA.

Chris Hanson, Global Head IMS Technology at Ventec comments: “Paul has extensive experience within the aerospace and military markets among others, and we’re enthusiastic to have him on board to grow our North American and Canadian client base.”

Additional content from Ventec International Group: 

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

12/02/2022 | Nolan Johnson, I-Connect007
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

11/11/2022 | Nolan Johnson, I-Connect007
The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/14/2022 | Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.