Ventec and Taiyo: The One-Stop Shop for PCB Materials at electronica 2022

Reading time ( words)

Ventec International Group Co., Ltd., will be exhibiting alongside its partner, Taiyo, at electronica 2022 in Munich. From 15 to 18 November 2022, visitors to the joint Ventec & Taiyo booth #207 in hall A1 will be invited to discover the collaboration’s one-stop shop for PCB material requirements. Attendees can find out more about Ventec’s unique laminate and prepreg capability as well as the additional technologies brought together for the PCB Materials One-Stop Shop. Alongside Ventec’s range and Taiyo’s color-based technology, the one-stop shop offers advanced copper foils, Thinflex FCCLs and coverlays, thermal interface materials from EMI Thermal, aluminum entry drill boards, and more. 

Ventec and Taiyo technology experts will be on-hand to share a beer and advise on the following:

  • aerolam – The dedicated portfolio developed by Ventec to cater for the complete spectrum of aerospace and defense applications.
  • autolam – Ventec’s PCB base material solution set, specifically curated for the diverse and unique requirements of automotive and EV/e-mobility applications.
  • tec-speed – Our comprehensive and enhanced set of high-performance, high-reliability high-speed/low-loss/high-frequency solutions.
  • tec-thermal – Ventec's IMS (Insulated Metal Substrate) families, laminates and prepregs for multilayer PCBs that guarantee excellent thermal performance.
  • Taiyo inks – Taiyo’s PSR-4000 and PSR-4100 series of two-component, alkaline developable LPI solder mask products, available in a full range of colors.

“Ventec is pleased to return to electronica,” enthused Mark Goodwin, COO EMEA & America at Ventec. “With our new partners Taiyo, we’d like to invite visitors to our booth not just to discuss our world-leading materials and solutions, but to enjoy a unique Ventec or Taiyo burger and some draught beer - after all, we all know just how busy these events can get and sometimes it’s good to just have a chat with colleagues and friends!”


Suggested Items

Taiyo’s Brian Wojtkiewicz Discusses Flex, HDI and More

10/25/2022 | Nolan Johnson, I-Connect007
Nolan Johnson spoke with Brian Wojtkiewicz at PCB West about Taiyo’s latest developments in solder mask technology. They discussed the company’s advances in flexible circuits, HDI, and much more. In particular, Brian discusses the importance of reliability in fabrication and assembly. "We’re always in the fabricators’ shops. I’m out in the field talking to them, helping the operators understand the process, and making things work better because then we don’t have issues down the road," he says.

Michael Carano: A Focus on Process Control, Part 2

09/28/2022 | I-Connect007 Editorial Team
In this second half of our conversation, Michael Carano discusses some of the metrics that fabricators need to consider before investing in new processes, especially process control technologies, and some of the challenges board shops face updating brownfield sites.

EIPC Technical Snapshot: Novel Laser-based Manufacturing Processes in Automotive Electronics

09/22/2022 | Pete Starkey, I-Connect007
“Summer is over, now it's back to work!” This was the opening line of the invitation to the 18th EIPC Technical Snapshot webinar, Sept. 14, following the theme of advances in automotive electronics technology, introduced and moderated by EIPC President Alun Morgan. The first presentation, entitled "The fully printed smart component—combining additive manufacturing and sensor printing," came from Jonas Mertin, a thin-film processing specialist at the Fraunhofer Institute for Laser Technology.

Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.