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IPC to Unveil New Member Magazine ‘IPC Community’ at IPC APEX EXPO 2023
November 10, 2022 | IPCEstimated reading time: 1 minute
IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.
The quarterly magazine will be offered in a digital format and will serve as a valuable new resource designed to keep the IPC global community up to date on the latest IPC news, including industry updates, trends and technology.
The digital edition will be made available the week of January 22, 2023 at IPC APEX EXPO. The magazine will receive bonus circulation with printed copies exclusively available at the show.
Inside “IPC Community,” readers will find feature stories that celebrate member success along with articles on advocacy efforts, committee and standards updates, education and workforce training developments, factory of the future solutions, advanced packaging updates emerging engineer and member profiles, and more.
“Our members and the broader global electronics manufacturing community look to IPC as a steadfast resource to keep them informed and educated on the latest industry developments,” said Brian Knier, IPC vice president, marketing, member success and sales. “We’re excited about the possibilities of “IPC Community” taking our ability to disseminate timely and important information to the next level; all while making sure IPC members’ voices are reflected within the magazine.”
Added Michelle Te, IPC Community magazine managing editor, “Through its family of publications offering thought-provoking, original content, I-Connect007 prides itself in being ‘good for the industry.’ With the launch of IPC Community, IPC and I-Connect007 are now even better for the industry. There is much to recognize and celebrate.”
To subscribe to “IPC Community,” visit www.ipc.org/subscribe-ipc-community. For inquiries regarding advertising opportunities within the magazine, contact Barb Hockaday, ad sales manager, at barb@iconnect007.com. To suggest a member success story, contact Michelle Te at michelle@iconnect007.com.
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Aaron Woolf, Dylan Peterson Join SIA Team
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It’s Only Common Sense: OCCAM—the Time Is Now
04/22/2024 | Dan Beaulieu -- Column: It's Only Common SenseOne of my favorite books is a little tome called Who Moved My Cheese? Even those of you who don’t spend a lot of time reading books have at least heard of it and know that it refers to people, especially in business, who are so stuck in their ways that they get upset when something changes. In our business, we know this kind of thinking is especially true. In fact, it always makes me laugh when one of my innovative friends finds a new way to do something and is afraid that someone will steal his idea. I always tell him that no one in our business, especially a PCB engineer, has ever thought about someone else’s innovative idea enough to steal it.
Digitalisation and ESG
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Real Time with... IPC APEX EXPO 2024: Looking Back, Looking Forward With IEC
04/19/2024 | Real Time with...IPC APEX EXPOIEC came to the RTW booth and discussed both the legacy of IEC's past and the vision for its future. Industry veteran Bruno Ferri highlighted his quarter-century tenure in the industry and with IEC since its founding. He still exhibits boundless enthusiasm for the industry. Brando Stone, a young professional and a future face of IEC, talked about IEC's plans going forward and his experience at this year's IPC APEX EXPO.