Zuken and CSA Catapult Present Results of R&D Collaboration


Reading time ( words)

Zuken, a global leader in the area of software and solutions for electronic and electrical engineering, and Compound Semiconductor Applications (CSA) Catapult are announcing an important milestone in their R&D collaboration aimed at building a development environment for state-of-the-art compound semiconductor products.

CSA Catapult is a UK government-funded non-profit organization headquartered in South Wales that was founded to help the UK become a global leader in compound semiconductors. Working with both large companies and start-ups, CSA Catapult develops and commercializes new semiconductor technology applications.

Collaborating with Zuken on a project to bring a power module layout from a graphical concept to a 3D model, CSA Catapult has identified several requirements and optimizations to Zuken’s CR-8000 Design Force chip, package and PCB co-design software that will provide designers of power electronic products with the ability to co-develop mechanical and electrical design in unison. The integration with industry simulation tools enables the efficient design iteration needed to effectively explore the design envelope for new compound semiconductor products.

As a result of the collaboration, an intuitive function was created to generate interconnections between chips and copper layers in a substrate or a printed circuit board, as well as a function to export a CAD model in a format compatible with FEM software. These advanced features will help designers significantly decrease the time required to generate a 3D model of the power module substrate, chip layout, and chip-to-chip, as well as chip-to-copper interconnections.

Dr. Alejandro Villarruel Parra, senior power electronics engineer at CSA Catapult, said, “The creation of a 3D model of the substrate, chip layout, and chip interconnections is an important part of the early-stage power module design process. Zuken’s advanced design solutions have helped to provide a preview of the module performance, which in turn makes our decision-making process faster when several concepts are being compared or helps to steer the refinement of the module geometry if a concept has already been selected.”

The new capability is included in the 2022 release of CR-8000 Design Force.

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/20/2023 | Andy Shaughnessy, Design007 Magazine
We’re in the middle of show season, and it certainly “shows.” Thank you very much. I’m here all week. Don’t forget to tip your wait staff. This week, we published a variety of articles, columns, and news items, and much of it centered on trade shows. Technical Editor Dan Feinberg brings us a report from CES 2023. IPC announced the winners of the Best Technical Paper awards for IPC APEX EXPO 2023. And we have an interview with Altium’s Rea Callender about the company’s educational efforts at APEX and around the globe.

Altium Focuses on Design Education

01/16/2023 | I-Connect007 Editorial Team
Altium keeps its eyes on the designers of the future. The company has been working with colleges and universities for years, providing free seats of Altium Designer for the next generation of PCB designers and design engineers. At IPC APEX EXPO 2023, Altium will be providing software for the finalists in the IPC Design Competition just as it did last year. They offer a variety of other educational programs as well, including Upverter classes and a design competition that aims to address environmental change. Here, Rea Callender, Altium’s VP of education, discusses its educational programs and plans for the week of the show.

The Battle of the Boards

01/12/2023 | Patrick Crawford, IPC
Last year, IPC held its first-ever design competition at IPC APEX EXPO in San Diego. PCB designers from around the world competed in a series of heats during the months before the show, culminating in a showdown on the show floor between the top three finalists. Rafal Przeslawski, now with AMD, took home the top prize last year. This year, the competition is back for its sophomore year. I asked Patrick Crawford, manager of design standards and related programs for IPC, to “layout” the details on the design contest, including lessons learned in 2022 and what’s new for the 2023 competition.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.