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Michael Thiel, VP of operations at Multicircuits, announced the installation of a new Nordson/March Plasma Unit. This unit is designed specifically to perform etchback operations on special materials such as Polyimide other thermal substrates. It can also handle PCBs with fine pitch, high frequency component geometry that requires low dielectric constant (DK) materials, primarily PTFE, which have poor adhesion rates.
“After performing extensive capability studies and in consideration of our current and future customer demands, we have found that the Nordson Plasma unit will meet our demanding requirements,” said Multicircuits’ Director of Sales and Marketing Jerry Smith. "Our customers’ needs are of the utmost importance and something we consider very seriously when making our equipment acquisitions.”
Pete Starkey, I-Connect007
Pete Starkey stops by the Aismalibar booth at electronica to hear from Uwe Lemke about the company’s plans to further expand its footprint in the Chinese PCB market and how evolving e-mobility constraints have propelled a growing demand for materials that can address electrical isolation and thermal conductivity concerns in high voltage battery systems. As always, Aismalibar is up to the task, having developed a new thin fluid coating technology that boosts the performance and reliability of any interface using the same foil-based technology that has long defined its impressive line of product offerings.
Pete Starkey, I-Connect007
Pete Starkey stopped by the Rogers booth at electronica to hear from Dr. Vitali Judin, the new business development manager at Rogers, on how the well-respected company is making a splash with new high frequency materials meant to address the rapidly evolving needs of the additive manufacturing sector. Rogers determined that digital light processing (DLP) 3D printing technique brought the combination of speed and resolution necessary to make additive manufacturing reasonably scalable, then partnered with Fortify to bring the processing consistency needed for the RF industry. With so many potential applications for this newly adapted technology, Rogers hopes to create a full slate of additive manufacturing materials for use in this sector and beyond.
Shavi Spinzi, Nano Dimension
Imagine fabricating PCBs without the hassle of drilled vias and metal plating. Imagine PCBs with near-perfect registration. If we take it to the next stage, imagine drawing electronics in 3D space. There is a way to do all this with additively manufactured electronics (AME). We just need to start to think in 3D. This will allow us to abandon the 2D limitations that we have become so used to and expand our horizons so that we can climb to higher levels of performance. In this article, I will explore the two fundamental capabilities that are the cornerstones for drawing electronics in 3D space, which is where AME technology and 3D design capabilities converge.