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Ventec International Group Co., Ltd. will be launching a range of new PCB laminate and prepregs at the IPC APEX EXPO in San Diego, CA. Between January 24th and 26th, visitors to booth 419 will be invited to discover Ventec’s latest tec-speed materials and a next-generation metal base laminate with exceptional thermal conductivity at their North American debut. Ventec’s comprehensive range of high-reliability PCB laminate and prepreg solutions will also be highlighted to the US manufacturing industry at the annual expo.
Ventec’s expanding range of PCB materials is designed to meet the technology needs of the PCB manufacturing industry. With laminates specifically developed for use in demanding conditions, Ventec’s products provide reliability and high-performance, supported by Ventec’s fully controlled and managed global supply chain to ensure dependable delivery even in an unpredictable worldwide landscape.
US-Launch of new laminates and prepregs
With its US debut at APEX, Ventec will be showcasing new additions to its tec-speed and tec-thermal ranges.
tec-speed 30.0 - VT-6735 - With a thermal conductivity of 1.15 W/mK, this laminate provides excellent thermal performance in applications operating at elevated temperatures. It also features a low dielectric constant (Dk) of 3.5, good insulation resistance and high dimensional stability for reliable operation over time.
tec-speed 20.0 - VTM-1000i - a new hydrocarbon laminate with excellent thermal reliability and incredibly high Dk (9.8) and low Df (0.0023). The material can be supplied bonded with or without a metal (aluminium or copper) base plate heat sink. tec-speed 20.0 VTM-1000i represents the top-tier option for use with satellite communications systems, GPS antennas, and other RF and microwave circuitry.
tec-speed 6.0 H-PK - VT-770/VT-770 (LK) - a halogen free and high thermal grade laminate/prepreg material that offers excellent performance in high temperature and harsh environmental applications. It offers an extended temperature range, making it reliable and resistant to thermal cycling. VT-770 (LK) features a low dielectric constant which helps minimize crosstalk in high-speed signals and is halogen free, making it an excellent choice for lead-free and environmentally friendly products.
tec-speed 6.0 - VT-462SH NF/LF - an ultra-low loss No Flow/Low Flow material designed to meet environmentally friendly requirements. It has good bonding and thermal performance in heat sink bonding and rigid-flex board applications, and it has a small flow range with consistent lamination.
VT-4BC - a high thermal conductive metal base laminate designed for use in applications requiring excellent performance in thermal management. With excellent mechanical properties, dimensional stability, and superior dielectric properties, the material is resistant to impact, moisture, and chemicals, making it a reliable choice for the most demanding applications.
Further highlights at the show:
autolam - developed for the automotive industry
Ventec’s premier set of PCB base material solutions that are specifically curated for the diverse and unique requirements of automotive applications.
aerolam - working for aviation, aerospace, and defense applications
A dedicated portfolio developed by Ventec to cater for the complete spectrum of aviation, aerospace, and defense applications, aerolam offers high-quality solutions for these demanding industries.
Professional Development Sessions
Our Senior Director of Business Development, Paul Cooke will be presenting three Professional Development Sessions in the run up to the show on Sunday 22nd and Monday 23rd November. His subjects focus on “Process Flow and Associated Defects” and “PCB Design for High Reliability”.
With products that cater for very exacting markets, including the defense and aerospace sector, and the automotive industry, Ventec’s range includes options for multiple applications across a range of budgets.
“The US manufacturing industry is of prime importance to Ventec. We are expanding our specialist and dedicated team focused on delivering our world-class products with similarly world-class expertise and support,” said Mark Goodwin, COO EMEA & America. “Our recent growth includes two exciting appointments in recent months, with both Chad Wood and Paul Cooke having joined our team as Director OEM Sales and Business Development, and Senior Director of Business Development respectively. We look forward to welcoming visitors to our booth in San Diego to discuss all the latest developments in our laminates range.”
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh
- The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art
- The Solutions Guide to... Thermal Management
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007eBooks library.