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Ventec Launches Highest Thermal Conductive Metal Base Laminate for IGBT & Power Markets
January 16, 2023 | Ventec International Group Co., Ltd.Estimated reading time: 1 minute
Ventec International Group Co., Ltd. is pleased to announce the launch of its latest high thermal conductive metal base laminate VT-4BC designed for use in applications requiring excellent performance in thermal management including super bright lighting, power modules, controllers, motor drives and rectifiers.
With high electrical breakdown strength, VT-4BC is designed to provide unparalleled reliability and improved performance over competing materials. It exhibits a thermal conductivity of 10 W/mK, offering superior heat dissipation even under the most demanding conditions.
In addition to its exceptional thermal performance, VT-4BC also boasts excellent mechanical properties, dimensional stability, and superior dielectric properties. It is also resistant to impact, moisture, and chemicals, making it a reliable choice for the most demanding applications particularly for IGBT and power markets.
The material will make its US debut at IPC APEX Expo 2023 from 24-26 January in San Diego, where visitors to booth 419 can discover the superior performance of VT-4BC alongside the full range of PCB base materials.
Ventec’s Global Head IMS Technology, Chris Hanson commented on the release of VT-4BC: “We are proud to introduce a product that provides unparalleled thermal performance and highest electrical breakdown strength. VT-4BC is designed for customers who value reliability and require improved performance over traditional materials. We look forward to showcasing it at IPC APEX Expo in January, where attendees can discover its superior capabilities firsthand.”
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Stan Rak: Elevating the Ideas and Insights of IPC's Thought Leaders Program
04/25/2024 | Stanton Rak, SF Rak CompanyAs a member of the IPC Thought Leaders Program (TLP), I am responsible for identifying knowledge-sharing opportunities that can generate ideas and insights that strengthen the IPC community as well as create a sustainable and lasting future for its members. I am delighted to highlight some of my recent contributions as a member of the TLP.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
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IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
Real Time with... IPC APEX EXPO 2024: A Conversation with IPC's CEO: New Venue, Sustainability, and More
04/23/2024 | Real Time with...IPC APEX EXPOBarry Matties hosts Dr. John W. Mitchell, CEO of IPC, on the final day of IPC APEX EXPO 2024. They discuss the new venue in Anaheim and broach a range of topics, from traffic and booth experiences to workforce development, sustainability, and the CHIPS Act. And they offer advice for newcomers as IPC looks forward to an even better show experience next year.