Rogers Corporation to Highlight Next Generation Innovative Materials at IPC APEX EXPO 2023


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Rogers Corporation will be exhibiting in booth #409 at IPC APEX EXPO in San Diego, CA Jan. 24–26, highlighting some of its next-generation high-performance circuit materials.  

Visitors to Rogers’ booth will learn about:

Kappa® 438 Laminates Now Available in 10 Mil

Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low-cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible. Standard thicknesses include 10, 20, 30, 40 and 60 mil.

COOLSPAN® Thermally & Electrically Conductive Adhesive:

COOLSPAN TECA is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards and has a storage life of up to 12 months from date of manufacture. COOLSPAN films provide a convenient and reliable approach to bond high power circuit boards, heavy metal back-planes, heat sink coins and RF module housings. This approach overcomes voiding and flow issues that are problematic for sweat soldering and dispensed adhesive approaches. COOLSPAN TECA films can be tack soldered in a fixture, ensuring accurate registration. This is followed by a tooled thermal cure or PCB press cycle.

Rogers and Fortify to jointly promote 3D Printing Technology:

On January 16, 2023, Rogers Corporation and 3D Fortify Inc. (“Fortify) announced they entered into an expanded agreement to jointly promote Rogers’ 3D printable materials and Fortify’s additive manufacturing equipment.  This agreement reinforces the continued commitment to develop electronic applications using the unique capabilities provided by high performance materials such as Rogers’ Radix™ printable RF materials and Fortify’s FLUX Series DLP printers.

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