Integr8tor and UcamX v2023.01 are Now Available

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Ucamco is proud to release Integr8tor v2023.01 and UcamX v2023.01. These new versions of our Pre-CAM and CAM software include plenty of additions to increase our customers’ productivity, highlighted by the topics below.

Integr8tor v2023.01

• Yellow solder mask color
• Plated/non-plated/backdrill-to-copper clearance analysis
• Conditional formatting
• Agile job queue handling
• Performance and security
• DPMX import

UcamX v2023.01

• YELO Mask Adjuster
• Object Summary Table
• Magnifier II
• Rout Manager
• Input GDSII
• SmartTest
• CAD Output Gerber X2/X3
• Input Drill/Rout
• Check for update 

Integr8tor and UcamX v2023.01 are now available for download for all maintenance contract users. Customers who wish to upgrade to this version outside of a maintenance contract or wish to take out a maintenance contract.

03/16/2023 | Pete Starkey, I-Connect007

Widely believed to be the traditional Centre of England, Meriden was a popular venue for a gathering of the UK printed circuit community this month. They braved the forecast of heavy snow for the Institute of Circuit Technology’s annual general meeting to learn about current developments and challenges in a thought-provoking technical seminar and to network with industry peers and contemporaries. Thankfully, the forecasted heavy snowfall did not reach Meriden until after the event; we only had a few flurries, although the weather caused considerable disruption elsewhere in the country.

02/28/2023 | Pete Starkey, I-Connect007

Day 2 of the EIPC Winter Conference at the Groupama Stadium in the Décines-Charpieu region of the Metropolis of Lyon in eastern France included a privileged visit to the Bugey Nuclear Power Plant for those who were registered and passed their security clearance. Such was the interest that the party was split into morning and afternoon groups. EIPC board member Martyn Gaudion, CEO of Polar Instruments, made a fine job of moderating Session 6 twice over.

02/27/2023 | Pete Starkey, I-Connect007

The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.