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I-Connect007 Launches New Micro Webinar Series: ‘Smarter Manufacturing Enabled with Inspection Data,’ Presented by Koh Young
March 13, 2023 | I-Connect007Estimated reading time: Less than a minute
Watch & learn!
In this engaging, 12-part micro webinar series, Koh Young topic expert Ivan Aduna examines the role inspection systems will play in the next industrial revolution. Viewers will learn about secure data collection, AI-powered solutions to manage and analyze data, and how to leverage IPC CFX-QPL to succeed in the transformation to Industry 4.0.
The first episode, “Smart Factory Success” is now available to view. In this 4-minute segment, viewers will discover how inspection systems and proprietary AI-based learning technologies incorporate the industry’s best True 3D measurement-based technologies. Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to... SMT Inspection, Today, Tomorrow and Beyond, throughout the series, presenter Ivan Aduna shares highly focused educational information on the use of data gathered during the inspection process.
This webinar series covers a comprehensive range of topics surrounding 3D inspection and process control. Each segment clocks in at around 5 minutes, with the entire series being viewable in under an hour.
Visit Smarter Manufacturing Enabled with Inspection Data and start watching, free, today!
Suggested Items
ASMPT to Exhibit Smart Manufacturing at IPC APEX EXPO 2024
03/27/2024 | ASMPTWith its innovative, data-driven Intelligent Factory concept and a comprehensive hardware and software portfolio around SMT production, market and innovation leader ASMPT will be a major presence at the IPC APEX EXPO 2024, the industry’s main event in California.
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
TRI Launches New Advanced Packaging 3D CT AXI Solution
03/26/2024 | TRITest Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.
Blackfox Ready for IPC APEX EXPO 2024
03/26/2024 | Andy Shaughnessy, I-Connect007Blackfox Training Institute offers IPC-certified training for a myriad of PCB assembly techniques and standard certifications. With many technologists beginning to eye retirement, this training is at a premium. I recently spoke with Jamie Noland, director of training and education for Blackfox, about the company’s latest educational efforts, and his plans for the upcoming IPC APEX EXPO, where Blackfox will be exhibiting.
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
03/25/2024 | IPCToday’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.