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Join us April 25 to learn about iNEMI’s new Board-Level Optical Interconnect Performance in Immersion-Cooled Environments project. Immersion cooling is gaining traction as a means of disruptive thermal management in high-performance computing and data centers; however, there is insufficient understanding of how optical interconnect components will perform in immersion-cooled environments. This issue affects OEMs and companies involved with photonics integration, mid-board optics and co-packaged optics.
The objectives of this new project are to:
Investigate and evaluate different on-board optical components and interconnect solutions in different immersion-cooled environments including single phase and dual phase.
Understand how design factors of interconnect components affect performance in an immersion environment.
Registration
These sessions are open to industry; advance registration is required, visit iNEMI's website.
Session 1
April 25, 2023
10:15-11:00 a.m. CEST (Europe)
4:15-5:00 p.m. CST (China)
Session 2
April 25
10:00-11:00 a.m. EDT (US)
4:00-5:00 p.m. CEST (Europe)
10:00-11:00 p.m. CST (China)
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