-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
MKS’ Atotech to Participate in ECTC
May 16, 2023 | MKS’ AtotechEstimated reading time: 2 minutes
At this year’s IEEE 73rd Electronic Components and Technology Conference (ECTC), MKS Atotech will be presenting and demonstrating its latest product and service innovations. The global high-end packaging conference is organized by the IEEE Electronics Packaging Society in Orlando, Florida, and takes place at the Grande Lakes Resort from May 30 – June 2, 2023.
This year the MKS Atotech team is represented by a select group of industry and technology experts from across various business sectors and can be found at booth 425. Aside from showcasing the newest products and upcoming innovations, MKS Atotech additionally has two technical paper presentations scheduled for the ECTC.
Roger Massey, Technical Marketing Manager Electronics, will introduce a method to evaluate crystallinity in plated micro vias and how it can be used as an indication of their reliability. Ralf Schmidt, Manager of R&D Semiconductor, will present the group’s latest findings on optimized copper-to-copper bond formation based on a suitable, metastable copper microstructure with an emphasis on compatibility with typical hybrid bonding process flows.
“A Predictive Metallographic Means to Identify the Relative Risk of Failure for Plated Micro Vias” by Roger Massey.
Date: Wednesday, May 31
Time: 4:45 p.m. (Session 8 Novel Reliability Test Methods)
“Optimization of the Cu Microstructure to Improve Cu-to-Cu Direct Bonding for 3D Integration” by Ralf Schmidt.
Date: Thursday, June 1
Time: 2:30 p.m. (Session 40: Interactive Presentations 4)
As a one-stop-shop and key partner for industries, MKS is driving Interconnect Optimization, thus creating significant market opportunities for MKS customers and the industry.
The Optimize the InterconnectSM offer focuses on providing next-generation advanced PCB and package substrate solutions for customers and partners. We are also committed to enabling increasingly smaller feature sizes and offering new solutions by combining ESI laser drilling technologies with our chemistry and plating equipment.
MKS has recently launched new opportunities in the production of next-generation package substrates. The offer includes a unique combination of MKS dedicated lasers, optics, and motion systems for precise, high speed via formation in ABF build-up laminate, in combination with the latest process chemistry and equipment for desmear and electroless copper metallization. Using the latest Equalized Curtain Flow (ECF) plating tool, MKS can support customers in their yield optimization and next-generation process development for advanced packaging applications.
- Geode - A New laser system for high precision and high-speed ABF build-up laminate processing
- G-Plate - New vertical desmear and electroless HVM plating tool for next-generation high-end package substrate
MKS is highly committed to driving next-level technological developments within its industries and key installations. The goal: accelerating time to market through combined capabilities, that allow us to view problems holistically and design solutions faster. This helps us to drive innovation for advanced electronic devices and offer customers and OEMs quicker development cycles for new products and materials enabling high-end SAP technology requiring <=5/5 um lines and spaces. We can shorten the typical ABF substrate product analysis cycle that normally takes 3 months or more to under just a month. We also provide the industry with a full stack of MKS combined services.
Conference: Electronic Components and Technology Conference (ECTC)
Date: May 30, to June 2, 2023
Booth: #425
Venue: The Grande Lakes Resort, Orlando, Florida
Suggested Items
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources: