Ormecon Publishes Article on New Ultrathin Solderable Surface Finish "Nanofinish"


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The new surface finish for printed circuit boards, "Nanofinish", recently released by Ormecon International, is based on a long-term research involving Ormecon's proprietary Organic Nanometal, and deeply scientifically investigated.

A scientific report has recently been published in "Nanoscale Research Letters", a peer-reviewed scientific online magazine edited by the renowned editor group "Springer". The article written by Dr. Bernhard Wessling and his research team can be accessed freely via:Abstract: http://www.springerlink.com/content/63260u84285330l4/Full text: http://www.springerlink.com/content/63260u84285330l4/fulltext.html

The new process is a process family comprising 4 different processes, see http://www.ormecon.de/pdf/products/pcb/productinformation/english/OCI_finish_processes_survey.pdf.

Additional technical information, external test reports and a discussion of the environmental aspects are available on Ormecon's website http://www.ormecon-nanotech.com/.

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