HKPCA and IPC to Hold International Technical Conference

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Concurrently held with the 2007 International Printed Circuit & Electronics Assembly Fair, the International Technical Conference, with the theme "Keys to PCB Manufacturers Success: Market, Materials and Processing", will be held on Dec. 5-6, 2007, at the Shenzhen Convention & Exhibition Centre, China.<?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" />

The two-day conference is a crucial and effective platform for senior management and industry practitioners to explore precious knowledge in managing the challenges confronted by PCB manufacturers. It will feature distinguished speakers, presenting marketing, materials and processing trends from a strategic perspective.

Global industry experts, including representatives from HKPCA, IPC and CPCA, will share in-depth analysis on the global PCB market development such as <?xml:namespace prefix = st1 ns = "urn:schemas-microsoft-com:office:smarttags" />China, North America and Eastern Europe. Worldwide key market leaders likewise will share sagacious insights on the latest technologies in PCB materials and processing.

Apart from industry experts, a representative of the banking industry will also address the global economic situation and forecast.

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