EIPC to Hold PCB Market and Technology Joint Conference


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The European Institute of Printed Circuits will hold a Joint Conference September 24-25, 2008 at the LENEXPO Exhibition & Conference Centre in St. Petersburg, Russia. The conference is being held in partnership with the Government of St. Petersburg, the Electronics Publishing House and the Russian Trade & Manufacture Ministry, and will run over two days.

On September 24, 2008, delegates will be able to listen to a wealth of speakers from around the world, covering many aspects of the PCB market and PCB related technologies. Walt Custer leads a field of industry experts, including Augusto Meozzi of Isola AG, Italy, who examine the European markets, read road-maps, and admire business models, to be followed by papers on environmental issues, laminates and drilling. Participants will include Albermarle, UL, Isola, Technolam, Lauffer, MIE, Schmoll, Lenz, HAM and TMT

September 25, 2008 sees the attention turning to Russian investment projects in PCB manufacturing described by Konstantin Prilipko, and Schweizer AG, with papers on surface preparation, final finishes, imaging, and reliability testing from Agfa, First EIE, DuPont, Orbotech, Olec, Huntsman, SAT, Atotech, Enthone, KIV PCB, Camtek, ATG and Multiline International Europa.

There will be parallel seminars on RoHS, Supply Chain Management, Packaging, and Electronics for Mass Production, whilst an exhibition will run throughout the three days providing an excellent platform for equipment and materials manufacturers, as well as CMS and PCB companies to display their abilities.

Early indications are for extremely strong attendance, so early registration for this one-off event is encouraged. Delegates are required to make their own arrangements for a Visa and to register with contact our Russian colleagues directly at dim@ecomp.ru or visit http://www.russianelectronics.ru/.

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