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Fujitsu will finish shift to lead-free soldering in October 2000
July 14, 2000 |Estimated reading time: Less than a minute
Fujitsu will finish shift to lead-free soldering in October 2000
The electronic device division of printed circuit board maker Fujitsu will completely stop using solders containing lead in October of this year, according to a story in Japan Chemical Week.
Mass production of one of the company's four new lead-free solders is set to begin shortly. All devices manufactured by the company will use lead-free solders, which will meet the requirements of manufacturers of electronic equipment, such as printed circuit boards used in audio visual products.
A tin/silver/copper alloy has been developed by Fujitsu as a solder for ball grid arrays, replacing a tin/lead eutectic soldering ball. A tin/bismuth/silver eutectic alloy has also been developed for use in ball grid arrays.
A tin/bismuth alloy has been developed for soldering copper/iron lead frames for quad flatpack packages (QFP). A nickel/palladium/gold solder has been developed for copper/lead frames for QFP.