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Photonic packaging and interconnection, global trends and markets 2000 - 2005
September 6, 2001 | BPAEstimated reading time: 1 minute
Photonic packaging and interconnection, global trends and markets 2000 - 2005: BPA holds executive briefing meetings A Cross Section of an Optoelectronic Hybrid PCB
In 2000, the market revenue for DWDM (Dense Wavelength Division Multiplex) optoelectronic components was approximately $5 billion, according to BPA Consulting. BPA estimate that by 2005, market revenue will have grown to more than $10 billion.
The speed and capacity of optical networks have increased rapidly through the 1990s, driven by demand for more data bandwidth. Technology and techniques such as DWDM originally developed for long-distance links are now being applied in metropolitan network applications as higher bandwidth connections move closer to individual homes and offices. Although this has brought new challenges for suppliers, resulting market opportunities have meant that many new companies have entered the marketplace.
BPA has launched a series of high-level and interactive Executive Briefing Meetings on Photonic Packaging and Interconnection, Global Trends and Markets 2000 - 2005. Following a successful meeting in London, BPA is holding meetings in Irvine, California on September 11, 2001; Chicago, Illinois on September 13, 2001; Tokyo, Japan on October 2, 2001; and Munich, Germany on November 29, 2001. The meetings will address major future issues, challenges and opportunities in the field of photonic packaging and interconnection, allowing delegates to map out and develop their own company's strategies.
For more information on the Executive Briefing Meetings, please contact Charlotte McKay at (+44) 1306 875 500 or email c.mckay@bpaconsulting.com.