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Meet Our Columnists and Advisors
July 7, 2010 | I-Connect007Estimated reading time: 17 minutes
With the marriage of I-Connect007 and SMT Magazine, the group of industry experts on hand to guide our readers through news, events, controversies, solutions and more--in every aspect of the electronics industry--has grown to an impressive list. Meet the new faces joining us from SMT Magazine and re-connect with I-Connect007's regular columnists and contributors.
Evelyn A. Baldwin is Sales Manager for 3M Electronics. She has been an SMTA member since 1988, and has 20 years of experience in the electronics industry as a material supplier. She may be contacted at (978) 886-9661; eabaldwin@mmm.com.
William E. Coleman, Ph.D., is Vice President of Technology at Photo Stencil, a manufacturer of stencils and STM Tooling. In this position, Coleman works closely with customers to understand their printing requirements. He also serves as chairman of the IPC Stencil Design Guidelines Subcommittee 5-21e, and is a member of IEEE and SMTA. Coleman has presented Technical Stencil Design reviews to SMTA chapters globally, and has authored several technical papers on all facets of printing technology. Coleman earned a BS in Physics from Wheeling Jesuit University, and an MS and Ph.D. in Physics from West Virginia University.Dennis Derfiny is the Principal Program Manager at Motorola. He has been with the company since 1995. His technical prowess in all aspects of manufacturing and hardware development engineering served him well as the Lead Program Manager for the RoHS and WEEE conversion program for GSM, UMTS and CDMA products in 2005-2006. Definy was instrumental in leading the development of many key LMR projects (Enterprise, Quantar, iDEN, Summit) in his tenure at the Government and Public Safety Division of Motorola. He may be reached at dennisde@comm.mot.com. Craig Hunter is Director, Global Internet Marketing at Vishay Intertechnology Inc., one of the world's largest manufacturers of discrete semiconductors (diodes, rectifiers, MOSFETs, optoelectronics and selected ICs) and passive electronic components (resistors, capacitors, inductors, sensors and transducers). He may be contacted at craig.hunter@vishay.com. Jennie Hwang, Ph.D. has contributed to SMT manufacturing since its inception and conducted pioneering lead-free R&D and hands-on production implementation. She has served as an advisor to major OEMs, EMS companies and the U.S. government, providing solutions to challenging problems in production defects, field failure and reliability issues. Having held senior executive positions with Lockheed Martin, Sherwin Williams, SCM Corporation and IEM Corporation, she is currently principal of H-Technologies Group, providing business, technology and manufacturing solutions to the global industry. Her formal education includes Harvard Business School Executive Program, Ph.D., M.S., M.A. and B.S. degrees in materials science and engineering, chemistry and liquid crystal science, respectively. Dr. Hwang has received numerous honors and awards including citations by the U.S. Congress, Honorary Doctoral degree, induction into WITI International Hall of Fame, named "R&D Star-to-Watch" by Industry Week; YWCA Women of Achievement Award; election to the National Academy of Engineering, etc. She is the author of 300+ publications including several textbooks, and a speaker in innumerable international and national events. She serves on the boards of many companies, civic groups and universities, and is also an invited distinguished adj. professor for the engineering school of Case Western Reserve University and serving on its Board of Trustees. She may be contacted at (216) 577-3284; jenniehwang@aol.com. Michael Konrad is President of Aqueous Technologies. He is an IPC SMEMA Council APEX Committee Member. Konrad was also a "High Performance Electronics Assembly Cleaning Symposium" panelist. He may be contacted at konrad@aqueoustech.com.Ray Prasad is the founder of Ray Prasad Consultancy Group. Before starting his consulting practice in 1994, he held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed the Intel PentiumPro™ package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company. Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BGA/CSP and lead-free professional courses at national and international conferences and in major OEM and EMS companies. Prasad is the recipient of SMTA's Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel's highest award--Intel Achievement Award. He is a columnist for the SMT magazine and also serves on its advisory board. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley. He may be contacted at 12945 SW Glen Oak Place Beaverton, OR 97007; (503) 628-1199; Fax: (503) 628-3399; smtsolver@rayprasad.com; www.rayprasad.com.S. Manian Ramkumar, Ph.D. is a Professor at the Rochester Institute of Technology (RIT) and is the Director for the Center for Electronics Manufacturing & Assembly (CEMA). He teaches courses in surface mount electronics packaging and manufacturing automation. He was instrumental in developing the Center at RIT. This Center is equipped with assembly and failure analysis equipment, to support hands-on training and applied research projects for industry. Dr. Ramkumar has been the principal investigator for several applied research projects. He has presented technical papers at the SMTA, APEX, IMAPS, ASME and IEEE conferences. He also teaches SMT and Advanced Packaging courses at the IPC-APEX and SMTA shows and for various companies on-site. He may be contacted at smrmet@rit.edu; http://smt.rit.edu. Rob Rowland is currently the Supplier Engineering Manager at RadiSys Corporation in Hillsboro, Oregon. Rowland has more than 25 years of experience with surface mount manufacturing technology. He is an active member of the SMTA, where he served two terms as a chapter president and multiple terms as technical director of SMTA International. In 1999, he received the Founders Award from the SMTA and in 2005 and 2008 he received Distinguished Committee Service Awards from the IPC for his contributions to IPC-7095. He was also a member of the IPC/EIA Surface Mount Council for nine years. Rowland is a frequent author and speaker at industry trade events. He is the co-author of the book Applied Surface Mount Assembly. He received a Bachelor of Science Degree in Manufacturing Engineering from Weber State University. He may be contacted at (503) 615-1354; rob.rowland@radiradisys.com. Vern Solberg is a technical consultant specializing in surface mount and microelectronic design and development. Additionally, he holds several patents for IC packaging innovations and is a member of many industry organizations, including IPC, IMAPS, SMTA and the JISSO International Council. He may be contacted at (408) 568-3734; vsolberg123@aol.com.Gary A. Tanel is SMTA Dallas Chapter President and Senior Vice President of the Associate Equity Group. He is the chairman of the Dallas M&A FORUM. He can be reached at (972) 751-0700 x 203; gtanel@associateequity.com.Laura J. Turbini, Ph.D. is an adjunct faculty member at the Universities of Toronto and Waterloo, and Chemistry Lab Manager and Principal Scientist at Research in Motion. She also serves on the Board of Directors at the SMTA. She may be contacted at (519) 888-7465, ext. 77744; lturbini@rim.com.Harald Wack, Ph.D. is the president of ZESTRON. Dr. Wack has authored and published several scientific articles and has provided technical information for various publications. He received his doctoral degree in organic chemistry from Johns Hopkins University. He may be contacted at (703) 393-9880; h.wack@zestronusa.com. These industry leaders from SMT Magazine join a plethora of I-Connect007 contributing authors and columinists: Dan Beaulieu is a well-known industry writer and columnist who has written sales and marketing columns for Circuitree, Printed Circuit Design & Manufacture, U.S. Tech and Printed Circuit News. He is also a feature article author who writes about various board shops and how they perform in the industry. He has over 30 years experience in the PCB industry. He is considered one of the industry's top marketing and sales experts, as well as perhaps the strongest and most focused strategist in the industry. He may be reached here.Eric Bogatin is a self-described "signal integrity guru" and president of Bogatin Enterprises. He received his B.S. in physics at MIT and his M.S. and Ph.D. degrees from the University of Arizona, Tucson, in 1980. He worked with a number of microelectronics companies, including AT&T Bell Labs, Raychem Corporation and Sun Microsystems, before serving as CTO of Interconnect Devices, Inc. Bogatin has taught signal integrity classes at conferences and workshops around the world. He is the author of Signal Integrity: Simplified, as well as hundreds of technical articles on signal integrity and interconnect design. He may be contacted here.Michael Carano is with OMG Electronic Chemicals (formerly Electrochemicals), a developer and provider of processes and materials for the electronics industry supply chain including fabrication of printed wiring boards, solar cell production, electronic packaging and lead-free metallization. He has been involved in the PWB, general metal finishing photovoltaic industries for over 29 years. His primary focus is on metallization technologies, electroplating, solderable finishes, HDI, selective metal finishing, semiconductor packaging and imaging processes. Carano is also involved in strategic planning and technology roadmap formulation and implementation. He has published over 75 technical articles and has presented numerous other papers throughout the world. He is the holder of nine U.S. patents and over 20 foreign patents covering a variety of topics. He is the past chairman of the IPC Suppliers Management Council and currently serves on the IPC Long Range Planning committee. Carano is also a member of the IPC Board of Directors and is serving a third term. He holds a Bachelor's degree in Chemistry from Youngstown State University where he has also completed two years of graduate school in polymer chemistry and has earned an MBA in International Marketing from Baker College. He may be reached here.Clyde Coombs, upon joining Hewlett-Packard in 1959, developed the plated-through-hole process that became the basis for printed circuit production for the next 40-plus years. At the same time, he started the California Circuits Association, to allow West Coast printed circuit fabricators and users to meet and discuss mutual issues. In 1967, he edited the first edition of the Printed Circuits Handbook published by McGraw-Hill. With its sixth edition, published in late 2007, it has grown from 16 chapters, in the first edition, to 64--representing the development and increasing complexity of printed circuit technology. It has been translated, used around the world and is considered the most influential reference on the total printed circuit process. Although now retired from HP, Coombs continues to consult, edit and contribute material to industry literature. He may be contacted here.Louis De Rose is president of De Rose and Associates, Inc., management and training consultants in Carlsbad, California. His clients include General Electric, IBM, Monsanto, Mobil Oil, Becton Dickinson and Control Data. Before establishing his own consulting firm, De Rose was professor and chair of the Business Management Department at Fordham University. He also taught at Cornell and Manhattan College. Author of the books Negotiated Purchasing, How to Negotiate Purchase Prices and The Value Network, he is a feature writer and consulting editor for Purchasing World Magazine, and writes extensively for business and technical publications. He may be reached here.Dan Feinberg is President and CEO of Fein-Line Associates, Inc., a consulting firm focused on the electronic interconnect and assembly industries and a founding Partner in the Quantum Performance Group, LLC, a market research firm. Feinberg was formerly president of Morton Electronic Materials (formally Dynachem), a $240 million division of Morton International, Inc., and a Group Vice President of the parent company Morton International until its acquisition by Rohm and Haas in 1999. He may be reached here.Joe Fjelstad, a founder of Silicon Pipe Inc., is an international authority and innovator in the field of electronic interconnection and packaging technologies with more than 150 U.S. patents issued or pending. He is the author of Flexible Circuit Technology and author, co-author or editor of several other books, including Chip Scale Packaging for Modern Electronics. He has also authored numerous technical papers and articles. He frequently presents seminars on PCB, flex circuit and chip scale packaging technologies at industry conferences. He may be reached here.Chet Guiles is a graduate of the University of New Haven with a BA in Chemistry (1971) and of the Syracuse University Eastern European languages Institute in Russian Language (1963, while on active duty with the USAF). Subsequent to his military service, he worked in the areas of corrosion metallurgy (Olin Metals Research), and PVC and silicone rubber technology (Automation Industries). Prior to joining Arlon in 1979, Guiles worked as a Senior Research Chemist at Pennwalt Corporation performing research on PVC stabilization.
At Arlon, Guiles has served in a number of roles including Technical Manager for the Silicone Rubber Group in DE, Quality Assurance Manager for the Delaware Microwave Materials operation, Division Technical Director and, most recently, as Director of New Business Development for the Electronic Substrates Division. Retired in 2004, he now acts as a part-time consultant to Arlon.
Guiles has several U.S. Patents and has written and published widely over the past 30 years in the area of materials for PCBs. His classic Everything You Ever Wanted to Know About Laminates, But Were Afraid to Ask was recently released in a 9th Edition in November 2008, available on-line in PDF format at www.arlon-med.com. He may be reached here.Stuart Hayton has spent over 20 years in the PCB industry in senior commercial and executive management roles for both PCB fabricators and vendors. Between 2003 and 2008, Hayton was Vice President Global Sales and Marketing for a leading industry capital equipment and services provider. He recently founded his own company, AccentiV, providing specialist advice and consultancy to leading players within the electronics industry. He may be reached here.Stephen J. Marshall is the National Sales Manager for Calumet Electronics Corporation and has been with the company since 1993. During that time, he has been involved in a variety of activities related to performance specifications and quality standards. With a front row seat to several industry-changing events, including the conversion to electronic production data, the dot.com bust, the growth of SMT, the introduction of RoHS and the current economic recession, Marshall is well-qualified to address conformance to specifications including IPC-6011, IPC-6012, MIL-PRF-31032 and MIL-PRF-5510 performance and qualification specifications and compliance with standards including ISO9001, AS9100 and Nadcap. He may be reached here.Clive "Max" Maxfield is the author and co-author of a variety of electronics books, including Bebop to the Boolean Boogie (An Unconventional Guide to Electronics), EDA: Where Electronics Begins, The Design Warrior's Guide to FPGAs (Devices, Tools, and Flows) and How Computers Do Math. He holds a B.Sc. in control engineering from Sheffield Polytechnic (now Sheffield Hallam University), England. Maxfield is president of TechBites Interactive, a marketing consultancy firm specializing in high tech. He may be reached here.Abby Monaco, CID, is a Product Manager for Intercept Technology Inc. She originally worked for Intercept as a software translation expert migrating and reverse engineering boards from third-party software into Pantheon PCB/Hybrid/RF layout software. She held positions in technical documentation, software quality assurance, software support and, most recently, product management. With over 10 years of experience in EDA, Monaco is actively involved in both technical product planning and direction and marketing. She may be reached here.Istvan Novak is a distinguished engineer at SUN Microsystems working on signal and power integrity designs of mid-range servers and new technology developments. Novak received his M.S. degree from the Technical University of Budapest, Hungary and his Ph.D. degree from the Hungarian Academy of Sciences in 1976 and 1989, respectively. In his personal time over the past twenty years, Novak has taught numerous signal and power integrity classes. He is the lead author of Frequency-Domain Characterization of Power Distribution Networks and the Executive Editor of Power Distribution Design Methodologies. He may be reached here.Dominique Numakura brings you the EPTE Newsletter from Japan. Numakura is the founder and Managing Director of DKN Research. He has been working for circuit board businesses and packaging material businesses more than 25 years. He has developed many advanced technologies in high-density substrates and materials over the last decade. Numakura has written more than 100 articles for major conferences and magazines, and he is the author of several books on electronic packaging technologies. He is a regular contributing writer of columns for magazines and newspapers. He has a master's degree in physical chemistry and nuclear chemistry from Ibaraki University, Japan. He may be reached here.Marissa Oskarson (aka The Printed Circuit Girl) grew up in her family's PCB business. At the early age of 10 she was already prospecting, pointing out electronic manufacturing companies to her dad when driving anywhere. She knows the business from the inside out and this has made her an outstanding independent sales representative. She owns The E-TEC Sales Network which focuses on providing PCB solutions for almost any requirement. She may be reached here.Paul Reid becan his career in PCB fabrication and reliability testing 29 years ago. He received a Bachelor of Science degree in 1975 and a Master of Science in 1980 from Rivier College, Nashua, New Hampshire. Reid has worked in Quality and Engineering in Managerial roles in New England and Canada. He has created technical animations of PCB fabrication, and recently, failure modes induced by thermal excursions in support of reliability testing. His animations have been used for education, technical reports and promotions internationally. Reid is a Program Coordinator at PWB Interconnect Solutions Inc., Ottawa, where his duties include reliability testing, failure analysis material analysis and PWB reliability consulting. He is currently investigating the reliability of microvias in military and lead/free applications and refining a test method Cyclic Time to Degradation (cT260). He may be contacted here.Andy Shaughnessy is the editor of PCBDesign007. As the former editor of Printed Circuit Design & Manufacture, he has the vision and drive to make PCBDesign007 the top online source of information for everyone whose livelihood depends upon PCB design. Shaughnessy has been a journalist for 17 years and is also a past conference chair for the PCB Design Conference series. He began covering PCB design and EDA in 1999. His articles have appeared in EE Times, PC Fab and Circuits Assembly. He may be reached here.Pete Starkey, a longtime industry editor based in the UK, joined I-Connect007 as its Technical Editor in 2008. Previously, Starkey served as Technical Editor for both the Good PCB Guide (UK) and Printed Circuit News. Most recently, he was Products Editor and Europe Editor for CircuiTree. Starkey has more than 30 years of experience in the PCB industry, with a background in process development, technical service and technical sales with PCB process vendors Shipley, Dynachem and MacDermid, followed by 15 years as technical director of Forward Group (prior to its acquisition by Viasystems). He is a Fellow of the Institute of Circuit Technology, a member of the SMART Group Technical Committee and an active supporter of the European Institute of Printed Circuits. He may be reached here.Bob Tarzwell is working to introduce new bleeding-edge, advanced circuit technology like lead-free, high-reliability electronics, heat-sinking technology and ultra-fine lines to the world. Since selling his company in 2000, Tarzwell has disseminated PCB high-tech to many companies as a consultant, and has written 10 books on PCBs and car racing. He has three patent-pending applications in fine lines, high-reliability and outer-space PCBs. He is currently semi-retired in the Bahamas, spending his free time writing books, working on antique cars and deep-sea fishing. He may be contacted here.Mark Thompson has been in the industry for 29 years. He started out in Stockton, California in 1980 as a driller and photo tech right out of high school. He moved to Santa Clara soon thereafter, and worked for Multiplex (which became ACI West). In 1993 he relocated to the Pacific Northwest, where he worked for Pacific Circuits, (which became TTM) and Praegitzer Industries. He started working with Prototron in 1996, and has been with the company ever since. He may be contacted here.Al Wasserzug is business development manager for Vulcan Flex Circuit Corporation. He is a 30+ year veteran of the PCB industry, with the last 22 years spent in either a direct sales position or as a chief executive. Wasserzug has held senior sales and business development positions at Teledyne Printed Circuit Technology and Pioneer Circuits. He may be reached here.Joel Yocom is a 25-year veteran of the PCB industry and has spent most of his life working with flexible circuits and the development of new products. He has worked for LPC and Parlex and consulted for a number of technology companies. Yocom has led turnaround activities that have transformed small EMS companies in a tough environment. Currently, he is the Business Development Manager for Conductive Inkjet Technology and has spent the last several years developing their revolutionary circuit technology and studying the emerging Printed Electronics market. He may be contacted here.