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Industry Titans Offer System Development Outlook
April 8, 2013 |Estimated reading time: 2 minutes
Technologists have long recognized that it’s more effective to look at all aspects of a product, from concept through to manufacturing, but in practice most design teams have been working in silos. However, in an industry of ongoing integration, restructuring, and cost reduction--and as systems become denser and more complex--it’s becoming more important to take a holistic view of product development for true innovation and sales growth.
The more complex systems get, the more subtle changes in the design of one section can alter performance in other areas. Similarly, small changes in component selection and layout can make it easier to manufacture and test a module.
More companies realize the need to alter their development processes to take a systems-wide view, but making these changes can be difficult. IPC is responding to this need with an end-to-end event--taking a broad look at system development.
IPC Electronic System Technologies Conference (ESTC) will bring a wealth of technical information for attendees and provide an unparalleled opportunity to develop across-industry contacts.
“IPC ESTC is not just bringing the supply chain together--this event is bringing together supply and demand,” says Sanjay Huprikar, IPC’s vice president of member success. “We believe this can facilitate a more thorough assessment of new products and services.”
The IPC ESTC technical conference will run May 20-23, 2013, with an accompanying exhibition on May 21-22 at the New Tropicana Hotel in Las Vegas, Nevada.
“This new event is not solely dedicated to packaging, design, or PCBs, but covers all of those areas through oral technical presentations, keynote addresses, and professional development courses,” says Senol Pekin, Ph.D., MBA, Intel Corporation, and general chair of the event.
The event’s keynote speakers include: James Quinn, vice president of sales, Multitest Elektronische Systeme GmbH; Dr. Choon Lee, senior vice president, Amkor Technology; Dr. Raj Pendse, chief marketing officer, STATS ChipPAC; Raj Master, general manager of IC packaging, SiOps, quality, and reliability, Microsoft; Dr. An-Yu Kuo, senior architect, Cadence Design Systems; Zane Ball, general manager, desktop client platforms, Intel Corporation; Derrill Wolkins, product development director, Medtronic; and Dr. Tin-Lup Wong, distinguished engineer and executive director, product group technology, Lenovo.
More Technology
The technical conference at ESTC is equally all-encompassing. The program committee, comprising close to 100 industry professionals, put together a comprehensive program consisting of 13 technical tracks with 80 paper sessions. Tracks include: product design and development; assembly and SMT; PCB fabrication, materials and design; quality and reliability; fab and silicon; test; equipment, tools and modules; packaging and substrates; mechanics; thermals; electrical; materials; and industry analysis and issues.