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Wearable Electronics Driving the Need for a New Level of Systems-in-Package Performance
December 11, 2014 |Estimated reading time: 1 minute
Impending limitations on the ability of planar interconnects to continue to satisfy the expectations created by Moore's Law are driving innovations in packaging technologies which in turn are enabling new applications to emerge. While wearable electronics have been with us for decades in the form of increasingly functional athletic devices and medical monitors, the missing link has been the ability of these devices to transmit information to a remote receiver in real-time. Developments in digital radio driven by the cellphone industry and the subsequent revolution in packaging in response to the need for miniaturisation of RF/wireless functionality are opening up a whole new range of applications. These applications are set to skyrocket as semiconductor and packaging technologies enable smaller size, lighter weight, longer range, and higher efficiencies. One of the most promising blends emerging technologies for engineered materials with 3D embedded SiP, transcending the conflict between miniaturization and high performance typical of conventional materials.
Introduction
As electronics have become lifestyle items, first in the form of cellphones and subsequently tablets and an expanding range of devices, the functionalities required by this evolution no longer necessarily scale according to Moore's Law. The added value perceived by the end customer is seen in many different ways. This suggests that miniaturization itself is no longer the sole vector, but that a complementary approach is emerging which combines functionality and form factor in a relationship which is becoming known as "More than Moore."
The horizontal vector of diversification is characterized by interaction with other people, things, and the environment, and for this to occur in a satisfactory manner the device must be capable of wireless communication. The miniaturization of function and proliferation of advanced packaging solutions which are now providing more silicon area than the area of the motherboard they sit on are offering the key to emergence and growth of a new applications opportunity: wearable electronics.Read the full article here.Editor's Note: This article originally appeared in the October 2014 issue of The PCB Magazine.