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Top 10 Most-read PCB New Product Stories of 2014
January 2, 2015 | I-Connect007Estimated reading time: 2 minutes
The past year brought a wide variety of new products and technologies to our readers around the world. As part of our annual industry review, the editors at I-Connect007 have pulled together a list of the top 10 new products from the pages of PCB007.
At #10, MacDermid Electronics Solutions Launches M-Speed: The company has announced the release of M-Speed, a complete chemical process supporting fabrication of high-frequency PCBs. This uniquely-formulated process provides low-profile innerlayer copper while delivering reliably strong adhesion to all high-speed dielectrics.
At #9, DuPont Teijin Films Intros Flame-retardant Polyester Films: The halogen-free, white Teijin Tetoron UF Polyethylene Terephthalate (PET) films and the Teonex QF Polyethylene Naphthalate (PEN) films combine chemical resistance, strength and insulation properties with the VTM-0 flame rating available from UL's UL 94 flame classification testing.
At #8, Plasma Etch Debuts CF4-free Plasma Etching Systems: Plasma Etch, Inc. is excited to introduce the first plasma etching systems used in the manufacturing production of PCBs that requires no CF4. Our patent pending system only uses three-phase power and compressed air.
At #7, R&D Interconnect Solutions Introduces INVISIPIN: Jim Russell, president and CEO of R&D Altanova, said, "We are pleased to introduce the INVISIPIN with its wide variety of configurations and applications. Test engineers will be delighted with the varieties of force ranges and working heights available."
At #6, Rogers Intros COOLSPAN Adhesive Film: Rogers Corporation Advanced Circuit Materials Division launched COOLSPAN Thermally & Electrically Conductive Adhesive (TECA) Film, a thermosetting, epoxy-based, silver-filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins, and RF module housings.
At #5, Atotech Launches Green Electroless Copper Solution: With Atotech's new Ecoganth series, PCB and IC-substrate manufacturers are enabled to meet future technical, ecological, and legal requirements.
At # 4, DuPont Debuts Pure Copper Conductive Ink: DuPont Microcircuit Materials (DuPont) is introducing its first pure copper conductive ink for photonic curing, DuPont PE510 copper conductor.
At #3, Orbotech Unveils Next-generation DI Solution: Orbotech Ltd. announced that it will be launching its newest Direct Imaging (DI) system, the cutting-edge Nuvogo 800, for digital imaging of fine-line HDI, MLB, flex, and rigid-flex applications for mass production, at the TPCA Show, booth #I1021, October 22-24.
At #2, Novoset, Lonza Intro Ultra-low Loss & High-temp Materials: Novoset, LLC and Lonza are pleased to announce the introduction of Primaset ULL-950 and Primaset HTL-300 ultra-low loss and high-temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries.
And at #1 spot, Isola Debuts Ultra-low Loss Materials: Tachyon laminates and prepregs are engineered to improve performance of high-speed digital designs by producing a very low dielectric constant and insertion loss. The product is specifically targeted for high-layer count backplanes for the growing 100 gigabit per second (Gbps) market with channel data rates in excess of 25 Gbps.