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Josh Goldberg, marketing specialist with Taiyo America, looks beyond fusion deposition modelling and considers what might be achievable in 3D printed circuit fabrication using UV curable materials and metallic powder laser sintering. If some real innovators take a serious interest, we could see results within five years.
Watch the interview here.
Organizing Materials Differently at Ventec
03/29/2023 | Pete Starkey, I-Connect007
At a recent industry conference, technical editor Pete Starkey caught some time with Ventec’s Mark Goodwin and Didier Mauve. In this conversation, Mark and Didier discuss Ventec’s work to curate their product offerings into functional categories based on function and target application. The pair also share their thinking on markets which they see as driving material development work. When material performance becomes an integral part of the PCB’s performance specifications, the traditional way of categorizing materials may not do the job.
MKS Discusses the Cutting Edge of Technology
12/20/2022 | Nolan Johnson, I-Connect007
During a recent tour of the MKS facility in Beaverton, Oregon, I met with Todd Templeton, Chris Ryder, Kyle Baker, and Martin Orrick. As a reminder, MKS acquired ESI in 2019 and has retained the ESI brand. In this interview, they explain their approach to HDI and ultra HDI, the current state of base materials, and what the future looks like on the cutting edge of technology.
EIPC: Europe’s Energy Disadvantage
12/15/2022 | Nolan Johnson, I-Connect007
EIPC’s Alun Morgan details the unsettling realities facing the European PCB industry due to the current war in Ukraine, and outlines steps that the EIPC plans to take to help raise awareness of the possible perils the industry might face as a result. Alun says, "It's possible that we may get more supply chain back in Europe, but that won’t happen overnight."