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Laser systems from micro material processing specialist LPKF Laser & Electronics will have a starring role at three stands. PCB prototyping will be featured at the main stand, while UV laser cutting and three-dimensional LDS MIDs will be shown at joint stands.
At the main stand (Stand 144) in Hall 7, LPKF will concentrate on in-house prototyping of PCBs. The top-of-the-line model, the ProtoLaser U3, can cut and structure both rigid and flexible board materials, ceramics, and TCO/ITO layers without damaging the delicate substrates. With it, for example, high-precision structures to 25 µm/50 µm (space/minimum con-ductor width) can be produced on Al2O3 ceramics with gold finishes. The LPKF ProtoLaser U3 is compact and can be rolled through any laboratory door.
The all-round talent ProtoMat S63 is suitable for nearly all applications related to in-house PCB prototyping. With a spindle speed of 60,000 rpm, it can be used for structuring, drilling, and depaneling of PCBs and test adapters as well as machining of housings. After structuring, additional steps such as through-hole plating, solder mask coating, assembly, and reflow soldering are performed. LPKF also provides user-friendly solutions for these processes to advance from idea to PCB in just one day. Another exhibit at LPKF’s main stand will be the optional feature for manufacturing solder paste stencils with lengths of up to 160 centimeters.
A UV laser cutting system will be able to be seen in action on the “Future Packaging” production line at the IZM joint stand (Hall 6, Stand 434). Part of the MicroLine2000 series, the system was developed specifically for integration into an SMT production line and features a fast, high-precision vision system, good part/bad part detection, an MES connection, and extensive PCB marking options for complete traceability. The laser depaneling system cuts assembled boards out of a larger panel without mechanically or dynamically loading the delicate structures or compo-nents on them.
LPKF will be represented at the 3D-MID e.V. joint stand (Stand 311) in Hall 7A with the LPKF Fusion3D 1200 laser structuring system. With this latest model in the Fusion3D series, LPKF extends its range of high-performance laser systems for Laser Direct Structuring (LDS). The LPKF Fusion3D 1200 enables economical production of injection-molded three-dimensional molded interconnect devices and features a height-monitored rotary indexing table and a new vision system.
LPKF Fusion3D 1200: The latest representative of the Fusion3D family shortens cycle times with rotary table, new processing unit and a vision system.
LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.