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With the LPKF StencilLaser G 6080, high-precision, high-speed drilling in stainless steel foils is made possible. The minimum achievable hole diameter is 30 µm.
LPKF Laser und Electronics AG develops and sells laser systems used in electronics fabrication, the automotive sector, and the production of solar cells. With the G 6080, LPKF offers a StencilLaser that can cut apertures in metal foils. Stencils, which are high-precision stainless steel foils used for printing of solder paste in electronics fabrication, make up the main application area. A new technical paper “Producing Small Holes with the StencilLaser G6080” (click here) outlines three different processes used to manufacture typical filter structures.
Factors such as the minimum hole diameter, the cutting and drilling quality, and the optimum performance are discussed in the paper. The StencilLaser can drill foils with thicknesses ranging from 30 µm to 1000 µm. Depending on material thickness and hole diameter, either percussion drilling, single-pulse drilling, or cutting is used. Holes of diameter 30 µm can be produced with these laser processes.
The technical paper shows the performance and cutting quality for different cutting parameters, heat affected zones, and process gases.
LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.