Lab Circuits Boosts Capacity with New 6-head Drilling Unit

Reading time ( words)

Lab Circuits has substantially increased the capacity of its machining department with the addition of a new 6-head drilling unit from the Swiss manufacturer, Posalux.

The addition of the new ULTRA SPEED 6000-6 g-line allows us to adapt to the latest technological requirements.
Equipped with a new camera system, it allows register settings using fiducial markers, offset and/or rotations. Its motors reach a rotation speed of 200,000 rpm, allowing the use of very small diameter drills. The new linear motors on the Z axis increase productivity and precision with quick and easy tool change, reducing downtime.
In the new PCB designs, the number of vias is increased considerably while their diameter is reduced, representing a substantial increase in processing times. The new ULTRA SPEED 6000-6 g-line will allow the correct sizing of the capacity of the machining department, which, with the addition of this machine, has increased its production capacity by more than 30%.



Suggested Items

EIPC Summer Conference 2019, Day 1

09/10/2019 | Alun Morgan, EIPC
The beautiful city of Leoben in central Austria provided the setting for the EIPC 2019 Summer Conference. In this article, EIPC Chairman Alun Morgan provides the highlights of the first day of the event, including a recap of the technical presentations.

Pollution Prevention Techniques: Rinse Water Reduction

08/30/2019 | Peter Moleux with contributions from Happy Holden
There are five general categories of common techniques for pollution prevention in a PCB fabrication facility: new processes to replace sources of pollution; extend the bath’s life; rinse water reduction; dragout reduction; and ventilation reduction. While this list is not all-inclusive, it provides an overview of the types of technologies used around the world that are important to consider. This article, examines rinse water reduction.

Vertical Conductive Structures, Part 3: Design Tool Techniques

08/23/2019 | Ed Hickey and Mike Catrambone, Cadence Design Systems, and Joan Tourné, Nextgin Technology
New vertical conductive structure (VeCS) technology can reduce layer count and improve signal integrity without the need for sequential technologies. VeCS is different than traditional through-hole vias, microvias, and ELIC designs, which are more expensive and require a high number of laminations, drilling, and plating cycles to build up a reasonable number of layers.

Copyright © 2019 I-Connect007. All rights reserved.