-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Novel High-Performance Substrate for Stretchable Electronics
June 15, 2015 | S. Yoshioka, T. Sawada and T. Abe, Panasonic CorporationEstimated reading time: 1 minute
Stretchable circuits are an evolving branch of electronics interconnection technology and the subject of growing interest to product developers seeking to provide novel wearable electronic solutions for consumer and medical markets. Such circuits are designed and manufactured using resilient materials which allow them to expand and contract with the movements of the user or to conform to nonplanar surfaces making possible a wide range of innovative and fanciful electronic interconnection devices. Obviously, the material used is a key element in making a stretchable circuit.
There are a range of different types of thermoplastic polymers available in film form that can be effectively stretched; however, once stretched beyond their elastic limit the material deforms to a new length greater than that which was designed.
There are as well elastomeric materials, such as urethanes, which have seen use in the manufacture of circuits which can be stretched and return to their original length. These materials tend to be opaque, which limits the scope of possibility for their use. A new transparent, high-performance thermal setting stretchable material could open doors to a range of new and innovative products.
New stretchable material characteristics
The new material is capable of stretching to 150% of the original length without hysteresis. (Figure 1 provides a comparison of stress-strain plots of the new material compared with thermoplastic PEN.)
Another key attribute of the material is its ability to reliably return to the original length even when stretched numerous times, as will likely be required in numerous future applications. The new material excels in this regard.
The mechanical and thermal properties of the new material are superior in many important areas including total elongation and adhesion both to copper foil and FR-4 laminate. It is also unique in that is has no melt point making it amenable to soldering with higher temperature lead free solders.
Editor's Note: This article originally appeared in the June 2015 issue of The PCBMagazine.
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.