Isola President and CEO Ray Sharpe to Retire


Reading time ( words)

Isola Group president and chief executive officer Ray Sharpe has announced plans to retire. He will stay with Isola until his successor has joined to ensure a smooth transition. The Board has already retained a search firm to guide the process of finding Isola’s next CEO.

"It has been a privilege to work with the dedicated people at Isola, who focus each day on advancing the company’s and its customers' best interests. I am confident in Isola’s future and the team’s ability to deliver distinct value. I look forward to spending more time addressing important family considerations," Sharpe said.

Kevin Burns, Chairman of Isola’s board of directors, commented, “Ray has been a very strong leader since Isola’s establishment in 2004. The company’s transformation has been impressive, and Isola is now positioned as the leading supplier of high-performance materials for the printed circuit board industry. The members of the Board are grateful to Ray for his many contributions and look forward to ensuring the company’s future success.”

Separately, Isola announced the retirement of its Executive Vice-President and Chief Financial Officer, F. Gordon Bitter. Donald Colvin, a member of Isola’s board of directors and the former Chief Financial Officer of ON Semiconductor and Caesars Entertainment, has been named as interim Chief Financial Officer.

About Isola

Isola Group, headquartered in Chandler, Arizona, is a global material sciences company focused on designing, developing, manufacturing, and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer printed circuit boards. The company’s high-performance materials are used in sophisticated electronic applications in the communications infrastructure, computing/networking, military, medical, aerospace and automotive industries. For more information, visit our website at www.isola−group.com.

Share

Print


Suggested Items

RBP Discusses New Management and Plans for the Future

11/23/2021 | Nolan Johnson, I-Connect007
Ernie Litynski, president of RBP Chemical Technology and Dan Carey, incoming executive vice president, brief Nolan Johnson on the recent organizational changes that brought Carey on board. Both Litynski and Carey outline how they see these changes benefiting their customers and partners, including in the defense and aerospace sectors. As they explain, it's their expertise at helping solve problems that customers value most.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/26/2021 | Andy Shaughnessy, Design007 Magazine
This week, we have a round-up of stories from around the industry, including a Real Time with… IPC APEX EXPO interview with Ventec, an article by Tamara Jovanovic about eliminating “garbage in, garbage out,” a review of an EIPC webinar by Pete Starkey, and news about another trade show going virtual this summer. And last but certainly not least, we bring you our one-minute video salute to all the fantastic people in this industry who we’ve worked with for decades. Enjoy!

Bonding Hybrid Multilayer Constructions at Rogers Corporation

03/10/2021 | Real Time with...IPC
John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing. SpeedWave is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.



Copyright © 2021 I-Connect007. All rights reserved.