Isola President and CEO Ray Sharpe to Retire

Reading time ( words)

Isola Group president and chief executive officer Ray Sharpe has announced plans to retire. He will stay with Isola until his successor has joined to ensure a smooth transition. The Board has already retained a search firm to guide the process of finding Isola’s next CEO.

"It has been a privilege to work with the dedicated people at Isola, who focus each day on advancing the company’s and its customers' best interests. I am confident in Isola’s future and the team’s ability to deliver distinct value. I look forward to spending more time addressing important family considerations," Sharpe said.

Kevin Burns, Chairman of Isola’s board of directors, commented, “Ray has been a very strong leader since Isola’s establishment in 2004. The company’s transformation has been impressive, and Isola is now positioned as the leading supplier of high-performance materials for the printed circuit board industry. The members of the Board are grateful to Ray for his many contributions and look forward to ensuring the company’s future success.”

Separately, Isola announced the retirement of its Executive Vice-President and Chief Financial Officer, F. Gordon Bitter. Donald Colvin, a member of Isola’s board of directors and the former Chief Financial Officer of ON Semiconductor and Caesars Entertainment, has been named as interim Chief Financial Officer.

About Isola

Isola Group, headquartered in Chandler, Arizona, is a global material sciences company focused on designing, developing, manufacturing, and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer printed circuit boards. The company’s high-performance materials are used in sophisticated electronic applications in the communications infrastructure, computing/networking, military, medical, aerospace and automotive industries. For more information, visit our website at www.isola−group.com.

07/15/2019 | I-Connect007 Editorial Team

Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.

07/12/2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle Engineering

Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can develop a loss of electrical insulation resistance between two biased conductors due to conductive filament formation.

07/12/2019 | Greg Ziraldo, Advanced Assembly

When considering the long-term reliability of a PCB, you must take into account any vias on your board. While an invaluable and essential part of board design, vias introduce weaknesses and affect solderability. This article will discuss vias, the potential concerns that are introduced into your board through their implementation, and how to minimize those concerns to acceptable levels.