Ventec USA Appoints Ken Stem as Technical Account Representative


Reading time ( words)

Ventec USA is proud to announce the appointment of Ken Stem as Technical Account Representative for the states of Washington, Oregon, Colorado, Utah, Arizona and Vancouver/British Columbia Canada.

Well-known and highly regarded in this territory, Ken joins Ventec USA’s west coast sales team and brings with him a wealth of industry experience. From a background of engineering, quality and operations management with a major PCB fabricator, Ken became a technical service specialist in laminates and chemical processes. For the last 12 years he has been a technical account manager with a leading distributor of laminates, processes and consumable materials, responsible for generating new product sales and providing technical service, as well as for new product testing and maintaining customer consignment inventory.

Ken has now chosen to focus his extensive skills on representing exclusively a primary laminate manufacturer, acknowledging the trend for OEMs to insist that their PCB suppliers buy specified laminate direct from the nominated manufacturer rather than through third party distributors, for reasons of supply chain integrity.

Ventec USA President Jack Pattie commented: “We are delighted to welcome Ken to the team supporting our rapidly-developing west coast market. His extensive product knowledge and in-depth understanding of PCB manufacturing technology, together with his resourceful and proactive commitment to customer support, make him a real asset to our organization.”

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.ventec-usa.com.

About Ventec USA

Ventec USA is a member of the Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, as well as low-Dk and low-Df materials for high frequency signal integrity, insulated metal substrate materials for thermal management and a comprehensive range of standard, halogen-free and high-temperature and high reliability grades of FR4. For more information, visit www.ventec-usa.com.

Share




Suggested Items

Breaking Down the Current Materials Market

06/08/2022 | Nolan Johnson, I-Connect007
Nolan Johnson meets with Isola’s Ed Kelley at DesignCon and takes a tour of the dynamics in play in the materials market. As Isola prepares to roll out an extremely low-loss, halogen-free product, Kelley says the company continues to work on how to make the product reproducible and available to customers around the world.

Engineering RF Dielectric Material to Enable 5G/6G Antenna Devices

04/11/2022 | Chudy Roosevelt Nwachukwu, ITEQ Corporation
Accurate characterization of frequency-dependent inhomogeneous dielectric material properties is key to the optimal design of high performance and cost-effective PCB antennas. These antennas will be required to enable the plethora of devices forecasted for 5G/6G communication. Therefore IT-88GMW, an advanced resin system reinforced with tightly woven thin glass fibers has been formulated to improve the Q-factor of interconnects and passive components fabricated on PCB laminates.

Improved Thermal Interface Materials For Cooling High-Power Electronics

03/31/2022 | Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.



Copyright © 2022 I-Connect007. All rights reserved.