Cicor White Paper Tackles Substrates in Implants

Reading time ( words)

Increasing complexity of today’s electrical circuits led to a growing demand for thin film “interface” substrates. Such substrates provide an important link between integrated electronics and peripheral accessories like amplifiers or signal processing units. Possible applications lie in the field of laser sub mounts with electrical connections for re-routing or even more sophisticated in the field of medical applications or implants. Whereas conventional thin film multilayer are mostly realized on stiff ceramic substrates (aluminum oxide, aluminum nitride), the extraordinary challenge with medical applications often comes from the required flexibility of the circuit. Biocompatibility and practical handling of the assembly play an important role in these applications.

This publication will show general aspects of the fabrication of thin film multilayer, stiff as well as flexible, and show the main differences which may appear, and be requested, in such systems.

A special focus shall be laid on an application for a retinal implant. In this application a vision chip, developed by the University of Ulm, is combined with a flexible thin film multilayer forming a human medical implant for regaining, at least partly, the eyesight for blind people. The special issues of the implantable chip are the low supply voltage and DC free external supply of the circuit.

The vision unit itself consists of a 40 x 40 pixels array with light sensors and electrode drivers, which are addressed sequentially to improve power consumption and spatial resolution of perception. This guarantees for a long-time operation and minimization of chemical reactions on the periphery.

Login Download White Paper



Suggested Items

Reflections on Supply Chain Issues

02/27/2019 | Nolan Johnson, PCB007
There are parallels in the PCB fabrication industry right now. PCB fabrication is a lot like that VW microbus. Everything is running just fine while the supply is there. However, the materials supply pipeline is becoming increasingly unpredictable.

Technology Ambassador Alun Morgan

12/10/2018 | Barry Matties, I-Connect007
Barry Matties speaks with Alun Morgan about his new position as technology ambassador for Ventec International Group. In this position, Alun will use his wealth of knowledge and experience to inform the supply chain better when it comes to topics like thermal management and the sometimes shaky connection between designers and material suppliers.

Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador

12/05/2018 | Pete Starkey, I-Connect007
At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.

Copyright © 2019 I-Connect007. All rights reserved.