LPKF Defends LDS Patent in Federal Patent Court


Reading time ( words)

Garbsen-based laser specialist LPKF today announced that it has won another key victory in the legal dispute with Motorola concerning the infringement of the patent for Laser Direct Structuring (LDS) developed by LPKF. A year ago, a lower court ruled in favor of LPKF in the patent infringement suit brought by LPKF against Motorola. Motorola subsequently appealed, but the court has not yet handed down a decision. At the same time, a decision was pending on the nullity action brought by Motorola against the patent in the Federal Patent Court in Munich. The China-based BYD Group, a Motorola supplier, joined this nullity action a few weeks ago.

On 9 July, the Federal Patent Court upheld the LDS patent as amended after LPKF provided clarifications. "Our LDS patent was strengthened by the clarifications we provided. Thanks to this, our chances of also prevailing in the patent infringement suit against Motorola in the higher court have undoubtedly improved," explains CEO Dr. Ingo Bretthauer.

Whether Motorola and BYD will appeal to Germany's Federal Court of Justice in the nullity case as well remains to be seen. LPKF will take action to ensure that the patent infringement proceedings now proceed as quickly as possible.

The LPKF LDS process is able to create circuit tracks on 3-D plastic parts

About LPKF

LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.

Share

Print


Suggested Items

Streamlining Inspection and Verification

01/23/2020 | Barry Matties, I-Connect007
Barry Matties speaks with Vladi Kaplan, VP of marketing for CIMS, about the company’s newest verification station, the benefits operators will see from its colorized real-time video, and how it makes verification much faster and much more efficient for companies pushing 100% inspection.

Selecting the Proper Flex Coverlayer Material

09/06/2019 | Dave Lackey, American Standard Circuits
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.

Microvias: Links of Faith are Not Created Equally

07/18/2019 | Jerry Magera and J.R. Strickland, Motorola Solutions Inc.
Microvias connect adjacent copper layers to complete electrical paths. There are copper-filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article discusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface.



Copyright © 2020 I-Connect007. All rights reserved.