Reading time ( words)
Who out there thought of it as a war? Is it? Well, we think it is—and a never-ending one at that. In fact, we thought it significant enough to devote all three of our August issues to the subject, because no matter how good you are or how great things are running, Murphy’s Law is right there, ready to take you down a peg or two—or worse. Think about it. You get one thing fixed or in line and something else pops up, just like the proverbial alligators in the swamp. And then, just as you have a handle on everything, specs change, controls tighten, a new customer comes on board, and there you are back at it again.
The subject of process failure turns out to be quite broad and affects essentially everyone in our industry, from the raw material suppliers to the circuit designer to the PCB processor to the assembly folks and on to the OEM. We all have a hand in it, both causing and solving problems and benefiting from solutions. Oh my!
We of course started with a survey to our general readership, which is rather broad. As expected, the survey takers covered the full spectrum, from supplier to OEM; even consultants chimed in (Table 1).
Company manufacturing volume was pretty evenly distributed between low, medium and high, with a few non-manufacturers. We also asked fabricators and assemblers where in their operation the most scrap was produced and surprisingly, it seems that every manufacturing area was prone to scrap. No areas stood out as especially scrap-prone.
Read the full article here.
Editor’s Note: This article originally appeared in the August 2015 issue of The PCB Magazine.
I-Connect007 Editorial Team
The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. Yet there are so many questions to be answered. The I-Connect007 Editorial Team met with Calumet’s Todd Brassard and Meredith LaBeau recently to get answers to these questions and find out where the UHDI market is headed.
Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.
Andy Shaughnessy, Design007 Magazine
It’s been a busy week for I-Connect007. Managing Editor Nolan Johnson and I covered PCB West at the Santa Clara Convention Center, and, as you’ll see in my article below the place was packed. We have an article about SMTA International, scheduled for the end of October. I think the trade show season is looking good into 2023. People are done with COVID shutdowns and ready to get back to live trade shows and conferences. We’ll be in Minneapolis to bring you the latest news and technical information. We also have a news report about the European Union committing to craft its own version of America’s CHIPS Act. There’s a great interview with Dana Korf and John Strubbe about the latest innovations in materials at TUC. And columnist Paige Fiet explains why she is committed to making manufacturing “cool” again to help recruit and retain young technologists.