i3 Electronics Holds Global Sales Meeting


Reading time ( words)

i3 Electronics, Inc. (i3) held a two-day global sales meeting from August 19th through August 20th. The sales meeting brought together employees from key organizational areas including management, supply chain, operations, business development, program management, marketing, finance, human resources and engineering to discuss company strategy on how to further increase i3’s presence in the electronics marketplace.

“Our 2015 global sales meeting was a great success. I have complete confidence in the i3 team as we continue to strengthen and grow our business. Our people and our technology are world-class and I am proud to be a part of such a great organization,” stated Dale Kersten, Executive VP and Chief Business Officer at i3.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging; high speed laminates; advanced assembly; reliability and signal integrity labs; high speed back plane & press fit assembly; and flexible electronics fabrication & assembly. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success.

Share

Print


Suggested Items

New Technical Director and Upcoming 2019 EIPC Summer Conference

05/15/2019 | Nolan Johnson and Pete Starkey, I-Connect007
Tarja Rapala-Virtanen is the newest technical director for the EIPC. I-Connect007's Nolan Johnson and long-time EIPC conference attendee Pete Starkey discuss her new role, the upcoming summer conference in Leoben, Austria, and the program in place for the June conference.

University Students Point to the Future in their Research

04/23/2019 | Nolan Johnson, I-Connect007
Cutting-edge automation, AI, machine learning, and Industry 4.0 are all part of the response to the increasing demands for printed circuit boards that are not only faster, smaller, and cheaper but also higher-frequency, lower-loss, more temperature tolerant, and higher reliability. In many cases, it will be unique and advanced research coming out of the university system that will help move the industry forward.

EIPC Winter Conference, Day 2

04/03/2019 | Alun Morgan, EIPC
After the papers from the first day of the EIPC Winter Conference in Milan on February 14–15, the delegates were hosted at a reception and plant tour of Elga Europe at their nearby production facility. Here's a recap of the events and highlights of the Day 2 of the conference.



Copyright © 2019 I-Connect007. All rights reserved.