EIPC Speednews: News from the European PCB Industry


Reading time ( words)

News from Denmark

- HDI at the Hilton

News from Israel

- Eltek receives new orders

News from the UK

- Zuken Innovation World 2015

Printed Electronics News

- Graphene to be used in bicycle tyres

- A new material for transparent electronics

News from WECC Members 

- IPC

- HKPCA

Click here for the International Events Diary 2015

Click here to download the complete SpeedNews Issue 22

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Suggested Items

Decreasing Bend Radius and Improving Reliability—Part I

10/11/2019 | Kelsey Smith, All Flex
Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend.

Communication, Part 2: Design Data Packages

10/11/2019 | Steve Williams, The Right Approach Consulting LLC
The first part of this six-part series highlighted ways that PCB fabricators and designers can better communicate, starting with how to qualify a board shop. In Part 2, Bob Chandler and Mark Thompson talk about the importance of preparing, sending, and receiving comprehensive (and ideally, perfectly complete) design data packages.

Standards: Why We Have Them and Live by Them

10/07/2019 | Alifiya Arastu, Jeff Beauchamp, Harry Kennedy, and Ruben Contreras, NCAB GROUP
Have you ever designed a board but received feedback that it couldn’t be manufactured unless changes were made? Or maybe you’ve designed a complex board and sent it to the factory only to find out that the manufacturer didn’t build the board to your expectations? PCBs are becoming more complex, factory options are growing, and expectations for product life cycles are becoming longer.



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