LPKF Strengthens Strategic Structures for LDS and Rapid PCB Prototyping


Reading time ( words)

LPKF.JPGLPKF Laser & Electronics AG enhances its structures in two relevant divisions. Two experienced engineers take over new positions of im-portant interfaces with customers.

Malte Fengler graduated from Hannover University earning a degree in electrical engineering and radio frequency technology. Since 2011 he has worked for the laser equipment manufacturer LPKF in the field of Molded Interconnect Device (MID) technology. This technology enables the production and placement of circuit layouts on complex three-dimensional carrier structures. More than half of the 3D components are produced with the LPKF LDS process (Laser Direct Structuring). Fengler is concerned with process engineering, feasibility studies, global cus-tomer support, and applications. In addition, he is in charge of existing as well as newly developed LDS substrate materials, and process con-sulting.

In August 2015, he succeeds Stephan Krause as the new Strategic Product Manager MID and takes over the responsibility for current and future markets as well as new applications in the field of LDS MID tech-nology

Stephan Krause has acted as a Sales Engineer since 2002 and support-ed the LPKF team as Strategic Product Manager LDS since August 2012. In October 2015, he moves to the Rapid PCB Prototyping division and takes charge of the worldwide RP sales activities. Moreover, he manages the contacts with the RP distributors.

Stephan Krause (left side) and Malte Fengler (right side) will work closely together in their new roles.

About LPKF

LPKF Laser & Electronics AG manufactures machines and laser sys-tems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the work-force is engaged in research and development.

Share

Print


Suggested Items

DuPont on New Beginnings and Empowering the Industry

05/21/2019 | I-Connect007 Editorial Team
Andy Kannurpatti gives the I-Connect007 team an overview of the latest news from DuPont Electronics and Imaging, including investments toward the new production assets in Ohio, Silicon Valley Technology Center, and other facilities. He also details how the company is engaging OEMs and PCB fabricators and design teams, as well as some exciting business updates coming this spring and summer.

Brexit Postponed Amid Political Gridlock; Industry Disruptions in Store

04/03/2019 | Chris Mitchell, IPC VP, Global Government Relations
The United Kingdom’s effort to leave the European Union, known by the nickname “Brexit,” is bogged down in political uncertainty, which in turn is creating disruptions in the global economy.

RTW IPC APEX EXPO 2019: Insulectro Sees Growth and Opportunities in Printed Electronics

03/11/2019 | Real Time with...IPC
Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.



Copyright © 2019 I-Connect007. All rights reserved.