Ventec USA to Showcase Latest Advancements in Prepreg & Laminate Production at PCB West


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Ventec USA, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, today announced that it will exhibit in Booth #615 at PCB West, scheduled to take place Sep. 15 - 17, 2015 at the Santa Clara Convention Center, CA.

Ventec USA President Jack Pattie, Account Manager Richard Bain and Technical Account Representative Ken Stem will be at the show to present the company’s latest investment in its streamlined distribution system that offers all the benefits of direct distribution, together with local technical and engineering support. The latest advancements in prepreg & laminate production including Ventec’s full range of low-Dk & low-Df materials for high frequency signal integrity, IMS materials for thermal management & a comprehensive range of standard, halogen-free & high-temp & high reliability grades of FR4 will also be highlighted.

Jack Pattie commented: “We are excited about exhibiting at PCB West, one of the industry’s most important meeting places. Being at the show is particularly timely for us as it coincides with the recent opening of our purpose-built and strategically located regional distribution center in Fremont, CA that supports our Northern California customers and complements the service provided to our North American customers from Ventec’s extensive distribution network in Massachusetts, Illinois, Southern California, Texas and Toronto.”

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.ventec-usa.com.

About Ventec USA

Ventec USA is a member of the Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, as well as low-Dk and low-Df materials for high frequency signal integrity, insulated metal substrate materials for thermal management and a comprehensive range of standard, halogen-free and high-temperature and high reliability grades of FR4.

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