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Innovative Circuits, Inc. a fabricator of rigid and flex printed circuits, recently became one of a very select group to be certified on use of Integral Technologies Zeta glass free laminate and film solutions. The Zeta family of materials is designed to meet the ever-changing demands in the electronics industry for miniaturization along with increased thermal and electrical requirements.
Zeta Cap is a high-Tg C-stage glass free copper-clad laminate designed to eliminate pad cratering in circuit board assembly. A related dielectric film, Zeta Lam, allows for ultra-thin (down to 12 microns) HDI buildup layers with improved thickness uniformity and transmission line performance. The third of the family, Zeta Bond is a B stage glass free bonding film capable of filling circuits and vias.
Innovative Chief Engineer Dale Lovell explains why they took on this challenge. “Over the years we have had clients who push the technology envelope. To keep up with this demand we have to continuously reinvest in equipment and building materials. We felt the Zeta products would provide our customers with another high reliability option to produce thinner circuit boards with better signal integrity.”
Since 1998, Innovative Circuits has specialized in high tech fabrication of flexible circuits; rigid-flex and multilayer rigid printed circuit boards. The company provides quick turn, R&D and mid-level production services to the commercial, defense and aerospace industries. The company is certified to ISO9001:2008 Quality Systems and ITAR Registered. To learn more visit www.innovative-circuits.com.