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- Ventec USA to Showcase Latest Advancements in Prepreg & Laminate Production at PCB West
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- IMPACT 2015 online registration is open now
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EPA, Industry Come Together in Visit to TTM Facility
07/18/2019 |
Kelly Scanlon, director, EHS policy and research
IPC member TTM Technologies is proud to show off the new wastewater-treatment system at its Sterling, Virginia plant, which is helping to enhance the company’s pollution prevention and resource recovery performance.
Microvias: Links of Faith are Not Created Equally
07/18/2019 |
Jerry Magera and J.R. Strickland, Motorola Solutions Inc.
Microvias connect adjacent copper layers to complete electrical paths. There are copper-filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article discusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface.
Dissecting the IPC Regional Survey on PCB Technology Trends
07/15/2019 |
I-Connect007 Editorial Team
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.
