Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Real Time with... IPC APEX EXPO 2024: Final Finishes and IC Substrate Manufacturing

04/24/2024 | Real Time with...IPC APEX EXPO
Editor Marcy LaRont and Richard DePoto, Uyemura's Business Development Manager, engage in a comprehensive discussion about the positive aspects of the show, the benefits of RAIG in final finishes, and the hurdles faced when upgrading your surface finish. Also discussed are the role of Uyemura's MEC pretreatment agents in IC substrate manufacturing and the importance of collaboration and knowledge sharing.

ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

04/23/2024 | ROHM
ROHM and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.

Real Time with... IPC APEX EXPO 2024: all4-PCB, A Premier Solution Provider for the PCB Industry

04/22/2024 | Real Time with...IPC APEX EXPO
In the PCB industry, all4-PCB, is a top-tier equipment supplier and process solution provider. Ralph Jacobo highlights the active market and the demand for high-quality equipment, discusses their existing customers, investment in advanced substrates, and smaller board shops.

PCB007 Magazine April 2024 — The Growing Industry Issue

04/15/2024 | I-Connect007 Editorial Team
After more than two decades of steady decline in the U.S., the PCB industry is finally growing in the West thanks to the CHIPS and Science Act, DoD funding, and hopefully, the passing of HR 3249, the Printed Circuit Board and Substrates Act. The U.S. is now in a race to regain what was lost and then some. But what does “growing” look like for the organizations that have received DoD funding, and for the rest of us? How can we sustain this growth?

Paul Cooke of Ventec Talks About Glassless Revolution, High Reliability

04/09/2024 | Marcy LaRont, PCB007 Magazine
Marcy LaRont from I-Connect007 caught up with Paul Cooke from Ventec at the SMTA UHDI Symposium on March 26 in Arizona. Paul discusses the challenges in developing future product lines for extremely high density, high reliability manufacturing, and focuses on the transition from glass to glassless substrate technology. He explains the advantages of using pure resin systems, enabling fabricators to create thinner materials for micro vias.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in