Ventec International to Exhibit at TPCA 2015


Reading time ( words)

Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, today announced that it will exhibit in Booth #K011 at the TPCA Show 2015, scheduled to take place October 21. - 23, 2015 at the Taipei Nangang Exhibition Center, Taiwan. Ventec's experts will present the company’s next generation low Dk material range and ultra-thin laminates and prepregs. 

Demand for high performance materials, particularly for high-end storage, telecommunications and automotive applications requiring high signal transmission speed and low transmission loss, is driving the advancement of high speed and high frequency solutions. Ventec offers a total solution of low loss materials and will be highlighting the VT-462 and VT-464 series of low Dk/low Df, high reliability products which offer excellent Laser drilling ability and better dimensional stability, lower cost and longer shelf life. To meet environmental requirements for non-brominated flame retardants, VT-464 achieves UL94 V-0 whilst retaining its low loss characteristics, and is based on a halogen-free epoxy resin technology. High glass transition temperature and excellent thermal reliability ensure compatibility with lead-free assembly processes.

Furthermore, increased miniaturization and higher component density, driven by greater functional demands from consumer, automotive, mil/aero and medical applications and devices, are accelerating rapid advances in laminate technology for next generation PCB’s. As a direct consequence, the demand for process capability of ultra-thin laminates and prepregs is on the rise. Ventec’s advanced solutions offer a range of ultra-thin materials with a minimum dielectric thickness of 25 microns.

The latest advancements in prepreg & laminate production including Ventec’s full range of IMS materials for thermal management & a comprehensive range of standard, halogen-free & high-temp & high reliability grades of FR4 will also be highlighted.

Ventec International Group’s COO Jason Chung commented: “Taiwan ranks at the top of the leaderboard for PCB manufacturing both in output quantity and value. It is no wonder therefore that the TPCA Show is the must-visit event for the entire PCB industry and for Ventec Asia it’s a highlight in our show calendar. At Ventec we work in partnership with our OEM customers to co-develop next generation products that meet their requirements. Throughout the show, our team of technical and supply chain experts will be on hand to meet our customers and help visitors select and specify the best materials that will enable optimum product performance and cost-effectiveness without compromising manufacturability or functionality.”

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.venteclaminates.com.

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.ventec-usa.com or www.ventec-europe.com.   

Share

Print


Suggested Items

Making Materials Succeed: Past, Present, and Future Trends

05/20/2019 | Nolan Johnson, I-Connect007
Tony Senese, manager for the business development group at Panasonic EMBD, gives Nolan Johnson an overview of materials and components as well as changing business models and methods to make materials succeed and how to stay profitable.

Alun Morgan on the Future of PCB Materials

05/16/2019 | I-Connect007 Editorial Team
The I-Connect007 editorial team asked Alun Morgan, technology ambassador for Ventec International Group, to discuss materials at a high level. Our conversation delivered a detailed overview of the current state of the electronics industry.

Averatek on the Future of Additive and Semi-additive Processing

05/10/2019 | Barry Matties, I-Connect007
Averatek’s President and COO Mike Vinson talks with Barry Matties about the benefits semi-additive and additive processing can bring to the shop floor as well as some of the current challenges and limitations that continue to leave many manufacturers hesitant to implement the technology.



Copyright © 2019 I-Connect007. All rights reserved.