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i3 Electronics, Inc announced today that it has earned the opportunity from a multi-national medical imaging conglomerate for the manufacture and advanced assembly of flexible substrates. This technology will be used to non-invasively measure real-time, three-dimensional organ abnormalities.
“i3 is a true enabler. From design, through fabrication, assembly and test, i3 provides a distinct advantage to our customers and their patients, with our life-saving technologies and world-class reliability,” said Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success.