Reading time ( words)
Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, today announced that it will exhibit in Booth #K011 at the TPCA Show 2015, scheduled to take place October 21. - 23, 2015 at the Taipei Nangang Exhibition Center, Taiwan. Ventec's experts will present the company's next generation low Dk material range and ultra-thin laminates and prepregs.
Demand for high performance materials, particularly for high-end storage, telecommunications and automotive applications requiring high signal transmission speed and low transmission loss, is driving the advancement of high speed and high frequency solutions. Ventec offers a total solution of low loss materials and will be highlighting the VT-462 and VT-464 series of low Dk/low Df, high reliability products which offer excellent Laser drilling ability and better dimensional stability, lower cost and longer shelf life. To meet environmental requirements for non-brominated flame retardants, VT-464 achieves UL94 V-0 whilst retaining its low loss characteristics, and is based on a halogen-free epoxy resin technology. High glass transition temperature and excellent thermal reliability ensure compatibility with lead-free assembly processes.
Furthermore, increased miniaturization and higher component density, driven by greater functional demands from consumer, automotive, mil/aero and medical applications and devices, are accelerating rapid advances in laminate technology for next generation PCB's. As a direct consequence, the demand for process capability of ultra-thin laminates and prepregs is on the rise. Ventec's advanced solutions offer a range of ultra-thin materials with a minimum dielectric thickness of 25 microns.
The latest advancements in prepreg & laminate production including Ventec's full range of IMS materials for thermal management & a comprehensive range of standard, halogen-free & high-temp & high reliability grades of FR4 will also be highlighted.
About Ventec International Group
Ventec International Group's COO Jason Chung commented: "Taiwan ranks at the top of the leaderboard for PCB manufacturing both in output quantity and value. It is no wonder therefore that the TPCA Show is the must-visit event for the entire PCB industry and for Ventec Asia it's a highlight in our show calendar. At Ventec we work in partnership with our OEM customers to co-develop next generation products that meet their requirements. Throughout the show, our team of technical and supply chain experts will be on hand to meet our customers and help visitors select and specify the best materials that will enable optimum product performance and cost-effectiveness without compromising manufacturability or functionality."
02/03/2020 | Nolan Johnson, PCB007
Dave Hoover of TTM discusses the Sessions @ the Intersection set for IPC APEX EXPO 2020—specifically, the two-part session he will host around the topic of 5G and materials.
01/31/2020 | Sergei Levchik, ICL-IP America
Sergei Levchik describes how testing has shown that FR-4 printed circuit boards do not contain free or residual tetrabromobisohenol-A (TBBPA).
01/28/2020 | Barry Matties, I-Connect007
Mark Goodwin, COO of Europe and the Americas for Ventec International Group, sits down with Barry Matties to explain his approach to supply chain management, efficient distribution, and maintaining definitive product identity at every stage.