EIPC Speednews: News from the European PCB Industry

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News from EIPC

- New EIPC Member Göttle GmbH & Co KG

- WECC Report 2014 Available Now

News from Germany

- Goepel Presents Free Webinar on "Quality Control of Plug-in Contacts Using 3D Measurement"

- Review FED Conference in Kassel

News from the UK

- Ventec is Venturing Worldwide

News from Spain

- CIPSA CIRCUITS Installed Two Orbotech Fusion AOI Systems and One Sprint 120 Inkjet System

News from Israel
- Frontline PCB Solutions and Nanjing College of Information Technology Launch an InCAM Excellence Academy Training Center

News for Productronica

- Preview for Aegis Software. Aegis Software Delivers a Real Industry 4.0 Solution at Productronica with the Release of FactoryLogix R3

Printed Electronics News

- Memory ink could revolutionise data storage in printed electronics

- Morgan conducts first graphene experiment at the University of Manchester

News from WECC Members

- IPC APEX EXPO Keynote Presentations Cover Innovations, Inventions and the Rise of Warbots

Click here for the International Events Diary 2015

Click here to download the complete SpeedNews Issue 28



Suggested Items

Decreasing Bend Radius and Improving Reliability—Part I

10/11/2019 | Kelsey Smith, All Flex
Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend.

Communication, Part 2: Design Data Packages

10/11/2019 | Steve Williams, The Right Approach Consulting LLC
The first part of this six-part series highlighted ways that PCB fabricators and designers can better communicate, starting with how to qualify a board shop. In Part 2, Bob Chandler and Mark Thompson talk about the importance of preparing, sending, and receiving comprehensive (and ideally, perfectly complete) design data packages.

Standards: Why We Have Them and Live by Them

10/07/2019 | Alifiya Arastu, Jeff Beauchamp, Harry Kennedy, and Ruben Contreras, NCAB GROUP
Have you ever designed a board but received feedback that it couldn’t be manufactured unless changes were made? Or maybe you’ve designed a complex board and sent it to the factory only to find out that the manufacturer didn’t build the board to your expectations? PCBs are becoming more complex, factory options are growing, and expectations for product life cycles are becoming longer.

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