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On the Line With... Podcast Talks With Cadence Expert on Manufacturing

04/18/2024 | I-Connect007
In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.

Now Available: Episode 4, Season 2 of Designing for Reality—Lamination

04/04/2024 | I-Connect007
I-Connect007 has just released the latest episode of its podcast series, On the Line With..., which focuses on designing for reality in the electronics industry. Multilayer boards bring along a completely different set of processes. In this installment, ASC Sunstone VP/Manager Matt Stevenson discusses manufacturing techniques for multilayer boards. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.

On the Line With… Talks With Cadence Experts on Changing How PCBs Are Designed and the Role of AI

03/21/2024 | I-Connect007
In this second episode, Cadence Distinguished Engineer Taylor Hogan and Product Management Director Patrick Davis discuss the role artificial intelligence and machine learning play in intelligent system design.

Standards Development Propels the Industry Forward

03/20/2024 | Teresa Rowe, IPC Senior Director, Assembly and Standards Technology
Standards development task groups will meet face-to-face at IPC APEX EXPO, April 6–11. The technical discussions provide an opportunity to share knowledge, learn from other subject matter experts, and network with others who have similar technical interests. You may remember the urgent need for coffee and the possibility of snagging a cookie or a granola bar to maintain the necessary energy level for these marathon sessions.

New Episode Now Available: Designing for Reality—CAM, Materials, and Imaging

03/14/2024 | I-Connect007
In Episode 3, host Nolan Johnson talks to ASC Sunstone VP/Manager Matt Stevenson about what happens after CAM preparations are complete. Stevenson addresses the role of materials and stackup considerations and also walks listeners through what happens in the Imaging process.
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