Last Call for IPC Flexible Circuits-HDI Forum Registration

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The IPC Flexible Circuits-HDI Forum, scheduled for October 28-30, 2015, in Minneapolis, Minnesota, will provide attendees the opportunity to learn through various tutorials, speaker presentations, and keynote speeches.

Focusing on military, aerospace, medical, and automotive electronics industries, the event will feature senior technologists from companies including TTM Technologies, DuPont, Battelle, Multek-Flextronics, Insulectro, Firan Technology Group Corporation, Orbotech, eSurface, Science Applications International Corp. (SAIC), RBP Chemical Technology, and Intrinsiq Materials.

To register for the event, click here.

07/15/2019 | I-Connect007 Editorial Team

Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.

06/21/2019 | Gen3

In this interview, Emma Hudson, CTO of Gen3, and Gayle Paterson, founder of Female Leaders in Tech, Everywhere (FLITE), discuss careers and the electronics industry.

05/28/2019 | M. Özkök, S. Lamprecht, A. Özkök, D. Akingbohungbe, and M. Dreiza, Atotech Deutschland Gmbh; and A. Stepinski, Greensource Fabrication

The continuously evolving electronics industry environment is causing the development of various electrolytic copper processes for different applications over the past several decades. This article describes the reasons for development and a roadmap of dimensions for copper-filled through-holes, microvias, and other copper-plated structures on PCBs.