Ventec International Presents Advanced Laminate Technology at productronica 2015


Reading time ( words)

Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth B1.142 at productronica 2015, scheduled to take place November 9th to 13th, 2015 in Munich, Germany. With a focus on the high reliability materials demanded by military, space, commercial aerospace and medical applications, Ventec's team of experts will present the company’s next generation ultra-thin laminates and prepregs. The latest advancements, including Ventec’s full range of IMS materials for thermal management & a comprehensive range of standard, halogen-free & high-temp & high reliability grades of FR4 will also be highlighted.

Increased miniaturization and higher component density, driven by greater functional demands from mil/aero, medical, consumer and automotive applications and devices, are accelerating rapid advances in laminate technology for next generation PCB’s. As a direct consequence, the demand for process capability of ultra-thin laminates and prepregs is on the rise. Ventec’s advanced solutions, which will be highlighted during the show, offer a range of ultra-thin materials with a minimum dielectric thickness of 25 microns.

Furthermore, demand for high performance materials, particularly for high-end storage, telecommunications and automotive applications requiring high signal transmission speed and low transmission loss, is driving the advancement of high speed and high frequency solutions. Ventec offers a total solution of low loss materials and will be highlighting the VT-462 and VT-464 series of low Dk/low Df, high reliability products which offer excellent Laser drilling ability and better dimensional stability, lower cost and longer shelf life. To meet environmental requirements for non-brominated flame retardants, VT-464 achieves UL94 V-0 whilst retaining its low loss characteristics, and is based on a halogen-free epoxy resin technology. High glass transition temperature and excellent thermal reliability ensure compatibility with lead-free assembly processes.

With the market need for ever-increasing thermal performance, particularly for automotive and other lighting and DC power conversion applications, the VT-4B family of thermally conductive IMS deliver an unprecedented level of thermal performance through their established ceramic-filled halogen-free dielectric technology. Multilayered constructions are made possible through resin-coated foil and resin-coated film options that will be presented at the show.

Ventec International Group’s COO USA & EUROPE Mark Goodwin commented: “Today’s electronics and PCB manufacturers expect reliable and high performance materials from their suppliers. By owning and fully controlling our global supply chain, we provide materials of consistent quality and reliability around the world without compromise. And particularly for the military and commercial aerospace sector, our full certification to AS9100 Revision C, the quality management standard specifically written for the aerospace and defense industry, positions Ventec as a leader in the design and manufacture of high reliability materials. Throughout Productronica, our team of technical and supply chain experts will be on hand to meet our customers and help visitors select and specify the best materials that will enable optimum product performance and cost-effectiveness without compromising manufacturability or functionality.”

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.venteclaminates.com.

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.   

Scoop Marketing Contact

Kim Sauer, Account Director

Tel: +44 7906 019 022

Email: kim@wearescoop.com

Share

Print


Suggested Items

iNEMI’s PCB Roadmap Explained

05/01/2020 | Pete Starkey, I-Connect007
In an informative and enlightening webinar, iNEMI Project Manager Steve Payne was joined by Isola Group CTO Ed Kelley to explain, review, and discuss the details of the recently published “iNEMI 2019 Roadmap for Organic PCBs.” Pete Starkey provides an overview.

Improving Copper Distribution in Pattern Plating Using Simulation Software

04/28/2020 | Pete Starkey, I-Connect007
Technical Editor Pete Starkey had the opportunity to sit in on a webinar presented by Robrecht Belis, manager of the surface finishing business unit at Elsyca—a Belgian company specialising in the simulation of electrochemical processes.

IPC Europe Shares Technical Education and Standards Awareness

04/22/2020 | Pete Starkey, I-Connect007
Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.



Copyright © 2020 I-Connect007. All rights reserved.