Ventec International Presents Advanced Laminate Technology at productronica 2015


Reading time ( words)

Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth B1.142 at productronica 2015, scheduled to take place November 9th to 13th, 2015 in Munich, Germany. With a focus on the high reliability materials demanded by military, space, commercial aerospace and medical applications, Ventec's team of experts will present the company’s next generation ultra-thin laminates and prepregs. The latest advancements, including Ventec’s full range of IMS materials for thermal management & a comprehensive range of standard, halogen-free & high-temp & high reliability grades of FR4 will also be highlighted.

Increased miniaturization and higher component density, driven by greater functional demands from mil/aero, medical, consumer and automotive applications and devices, are accelerating rapid advances in laminate technology for next generation PCB’s. As a direct consequence, the demand for process capability of ultra-thin laminates and prepregs is on the rise. Ventec’s advanced solutions, which will be highlighted during the show, offer a range of ultra-thin materials with a minimum dielectric thickness of 25 microns.

Furthermore, demand for high performance materials, particularly for high-end storage, telecommunications and automotive applications requiring high signal transmission speed and low transmission loss, is driving the advancement of high speed and high frequency solutions. Ventec offers a total solution of low loss materials and will be highlighting the VT-462 and VT-464 series of low Dk/low Df, high reliability products which offer excellent Laser drilling ability and better dimensional stability, lower cost and longer shelf life. To meet environmental requirements for non-brominated flame retardants, VT-464 achieves UL94 V-0 whilst retaining its low loss characteristics, and is based on a halogen-free epoxy resin technology. High glass transition temperature and excellent thermal reliability ensure compatibility with lead-free assembly processes.

With the market need for ever-increasing thermal performance, particularly for automotive and other lighting and DC power conversion applications, the VT-4B family of thermally conductive IMS deliver an unprecedented level of thermal performance through their established ceramic-filled halogen-free dielectric technology. Multilayered constructions are made possible through resin-coated foil and resin-coated film options that will be presented at the show.

Ventec International Group’s COO USA & EUROPE Mark Goodwin commented: “Today’s electronics and PCB manufacturers expect reliable and high performance materials from their suppliers. By owning and fully controlling our global supply chain, we provide materials of consistent quality and reliability around the world without compromise. And particularly for the military and commercial aerospace sector, our full certification to AS9100 Revision C, the quality management standard specifically written for the aerospace and defense industry, positions Ventec as a leader in the design and manufacture of high reliability materials. Throughout Productronica, our team of technical and supply chain experts will be on hand to meet our customers and help visitors select and specify the best materials that will enable optimum product performance and cost-effectiveness without compromising manufacturability or functionality.”

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.venteclaminates.com.

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.   

Scoop Marketing Contact

Kim Sauer, Account Director

Tel: +44 7906 019 022

Email: kim@wearescoop.com

Share

Print


Suggested Items

A Conversation with Karen McConnell—An Emerging Engineer Program Mentor

07/22/2019 | Linda Stepanich, IPC
IPC’s Emerging Engineer program, launched in 2016, provides early career professionals an opportunity to learn from dedicated industry volunteers who participate in IPC standards development. IPC’s editorial staff had the opportunity to talk with one of those dedicated volunteers, mentor Karen McConnell, Senior Staff Engineer CAD CAM, Northrop Grumman, about why she participates as a mentor in IPC’s Emerging Engineer program.

EPA, Industry Come Together in Visit to TTM Facility

07/18/2019 | Kelly Scanlon, director, EHS policy and research
IPC member TTM Technologies is proud to show off the new wastewater-treatment system at its Sterling, Virginia plant, which is helping to enhance the company’s pollution prevention and resource recovery performance.

Dissecting the IPC Regional Survey on PCB Technology Trends

07/15/2019 | I-Connect007 Editorial Team
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.



Copyright © 2019 I-Connect007. All rights reserved.